Element for electronic component
View Patent ↗A surface of an anode body made of a metal material having a valve action is oxidized so as to form a dielectric layer, a conductive polymer precursor solution is stuck to the surface of the dielectric layer, the solvent is evaporated in an atmosphere of a relative humidity of 30 to 45% to be removed, electropolymerization is carried out so as to obtain a semiconductor layer having projections being 2 to 70 μm high on the outer surface thereof, a conductive carbon layer is laminated using a conductive carbon paste, and a conductive metal layer containing a metal conductive powder and a binder is laminated so as to obtain an element for an electronic component, and the element for an electronic component is encapsulated by a resin so as to obtain an electronic component.
1. An element for an electronic component comprising
a semiconductor layer which has projections having a height of 2 to 70 μm on an outer surface of the semiconductor layer, wherein each of the projections has a plurality of microspikes thereon.
2. An element for an electronic component comprising a semiconductor layer and one or more conductor layers which are laminated, in which
there are projections on an outer surface of the semiconductor layer,
the conductor layer in contact with the outer surface of the semiconductor layer is a conductive carbon layer,
the projections on the outer surface of the semiconductor layer are embedded into the conductive carbon layer to not less than 25% deep of a thickness of the conductive carbon layer, and
the tip of the projections does not protrude from the outer surface of the conductor layer, wherein each of the projections has a plurality of microspikes thereon.
3. An element for an electronic component comprising an anode body, a dielectric layer, a semiconductor layer and one or more conductor layers which are laminated in this order, in which
there are projections on an outer surface of the semiconductor layer,
the conductor layer in contact with the outer surface of the semiconductor layer is a conductive carbon layer,
the projections on the outer surface of the semiconductor layer are embedded into the conductive carbon layer to not less than 25% deep of a thickness of the conductive carbon layer, and
the tip of the projections does not protrude from the outer surface of the conductor layer, wherein each of the projections has a plurality of microspikes thereon.
4. The element for an electronic component according to claim 1 , wherein the size of the projections by observation from the normal direction of the semiconductor layer is not more than three times the height of the projections.
5. The element for an electronic component according to claim 1 , wherein the number of the projections per unit area on the outer surface of the semiconductor layer is 10 1 to 10 4 /mm 2 .
6. The element for an electronic component according to claim 1 , wherein the semiconductor layer comprises an organic semiconductor.
7. The element for an electronic component according to claim 6 , wherein the organic semiconductor is a conductive polymer having a repeating unit derived from at least one compound selected from pyrroles, thiophenes, alkylthiophenes, alkylenedioxythiophenes, anilines, phenylenes, acetylenes, furanes, phenylenevinylenes, acenes, and azulenes.
8. The element for an electronic component according to claim 6 , wherein the organic semiconductor contains a conductive polymer having a repeating unit derived from 3,4-ethylenedioxythiophene.
9. The element for an electronic component according to claim 6 , wherein the semiconductor layer further comprises arylsulfonic acid or its salt.
10. The element for an electronic component according to claim 2 , wherein the conductor layer comprises the conductive carbon layer and a conductive metal layer.
11. The element for an electronic component according to claim 10 , wherein the conductive metal layer comprises a conductive metal powder and a binder.
12. The element for an electronic component according to claim 11 , wherein the conductive metal powder is at least one powder selected from the group consisting of silver powder, copper powder, aluminum powder, nickel powder, copper-nickel alloy powder, silver alloy powder, silver mixed powder, and silver coated powder.
13. The element for an electronic component according to claim 11 , wherein the binder is a resin.
14. The element for an electronic component according to claim 10 , wherein the conductive metal layer comprises 3 to 10% by mass of resin and 90 to 97% by mass of conductive metal powder.
15. An electronic component comprising an element for an electronic component according to claim 1 in which the element is encapsulated.
16. An electronic component according to claim 15 , wherein the electronic component is a solid electrolytic capacitor.
17. An element for an electronic component comprising a semiconductor layer which has projections having a height of 2 to 70 μm on an outer surface of the semiconductor layer, wherein the surface of the projections is rough.
18. An element for an electronic component comprising a semiconductor layer and one or more conductor layers which are laminated, in which
there are projections on an outer surface of the semiconductor layer,
the conductor layer in contact with the outer surface of the semiconductor layer is a conductive carbon layer,
the projections on the outer surface of the semiconductor layer are embedded into the conductive carbon layer to not less than 25% deep of a thickness of the conductive carbon layer, and
the tip of the projections does not protrude from the outer surface of the conductor layer, wherein the surface of the projections is rough.
19. An element for an electronic component comprising an anode body, a dielectric layer, a semiconductor layer and one or more conductor layers which are laminated in this order, in which
there are projections on an outer surface of the semiconductor layer,
the conductor layer in contact with the outer surface of the semiconductor layer is a conductive carbon layer,
the projections on the outer surface of the semiconductor layer are embedded into the conductive carbon layer to not less than 25% deep of a thickness of the conductive carbon layer, and
the tip of the projections does not protrude from the outer surface of the conductor layer, wherein the surface of the projections is rough.
20. The element for an electronic component according to claim 17 , wherein the size of the projections by observation from the normal direction of the semiconductor layer is not more than three times the height of the projections.
21. The element for an electronic component according to claim 17 , wherein the number of the projections per unit area on the outer surface of the semiconductor layer is 10 1 to 10 4 /mm 2 .
22. The element for an electronic component according to claim 17 , wherein the semiconductor layer comprises an organic semiconductor.
23. The element for an electronic component according to claim 22 , wherein the organic semiconductor is a conductive polymer having a repeating unit derived from at least one compound selected from pyrroles, thiophenes, alkylthiophenes, alkylenedioxythiophenes, anilines, phenylenes, acetylenes, furanes, phenylenevinylenes, acenes, and azulenes.
24. The element for an electronic component according to claim 22 , wherein the organic semiconductor contains a conductive polymer having a repeating unit derived from 3,4-ethylenedioxythiophene.
25. The element for an electronic component according to claim 22 , wherein the semiconductor layer further comprises arylsulfonic acid or its salt.
26. The element for an electronic component according to claim 18 , wherein the conductor layer comprises the conductive carbon layer and a conductive metal layer.
27. The element for an electronic component according to claim 26 , wherein the conductive metal layer comprises a conductive metal powder and a binder.
28. The element for an electronic component according to claim 27 , wherein the conductive metal powder is at least one powder selected from the group consisting of silver powder, copper powder, aluminum powder, nickel powder, copper-nickel alloy powder, silver alloy powder, silver mixed powder, and silver coated powder.
29. The element for an electronic component according to claim 27 , wherein the binder is a resin.
30. The element for an electronic component according to claim 26 , wherein the conductive metal layer comprises 3 to 10% by mass of resin and 90 to 97% by mass of conductive metal powder.
31. An electronic component comprising an element for an electronic component according to claim 17 in which the element is encapsulated.
32. An electronic component according to claim 31 , wherein the electronic component is a solid electrolytic capacitor.