IP Library Granted Patent US 8,293,375
Granted Patent B2
US 8,293,375 · App. 12/867,636 · Granted Oct 23, 2012

Heat sealable multilayer film

Assignee: Mitsui Chemicals Tohcello Inc.
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Quick Facts
Patent No.
US 8,293,375
App. No.
12/867,636
Granted
Oct 23, 2012
Kind
B2
Abstract

At heat sealable multilayer film includes a cohesive failure heat seal layer (1) that includes a resin composition including 75 to 85 wt % of a propylene polymer (A) and 15 to 25 wt % of an ethylene polymer (B) (based on the total of (A) and (B) of 100 wt %), and a support layer (2) including a propylene block copolymer (C). The heat sealable multilayer film can package oil-rich contents to be retort sterilized without separation (delamination) of a cohesive failure heat seal layer due to penetration of oil from the contents and have appropriate heat seal strength and excellent easy openability, and can be opened with stable peel conditions.

Claims (10)

1. A heat sealable multilayer film comprising a cohesive failure heat seal layer (1) that comprises a resin composition including 75 to 85 wt % of a propylene polymer (A) and 15 to 25 wt % of an ethylene polymer (B) selected from a high-pressure low-density polyethylene (E) which has MFR (JIS K 7210, 190° C.) of not more than 9 (based on the total of (A) and (B) of 100 wt %), and a support layer (2) comprising a propylene block copolymer (C), wherein the propylene block copolymer (C) for the support layer (2) has a melting point higher than that of the propylene polymer (A) for the cohesive failure heat seal layer (1).

2. The heat sealable multilayer film according to claim 1 , wherein the propylene polymer (A) for the cohesive failure heat seal layer (1) is a propylene/α-olefin random copolymer (D) having a melting point of 135 to 150° C.

3. The heat sealable multilayer film according to claim 1 , wherein the ethylene polymer (B) for the cohesive failure heat seal layer (1) is a composition comprising a high-pressure low-density polyethylene (E) and an ethylene/α-olefin random copolymer (F).

4. The heat sealable multilayer film according to claim 1 , wherein the support layer (2) comprises a composition comprising the propylene block copolymer (C) and an ethylene/α-olefin random copolymer (G).

5. The heat sealable multilayer film according to claim 1 , wherein the support layer (2) comprises a composition comprising the propylene block copolymer (C) and an ethylene polymer (B).

6. The heat sealable multilayer film according to claim 5 , wherein the ethylene polymer (B) contained in the support layer (2) is a high-pressure low-density polyethylene (E).

7. The heat sealable multilayer film according to claim 6 , wherein the high-pressure low-density polyethylene (E) contained in the support layer (2) has MFR (JIS K 7210, 190° C.) of not more than 9.

8. The heat sealable multilayer film according to claim 1 , further comprising a laminate layer (3) that is laminated on the surface of the support layer (2), on the opposite side of which the cohesive failure heat seal layer (1) is laminated.

9. The heat sealable multilayer film according to claim 8 , wherein the laminate layer (3) comprises a propylene polymer (H).

10. The heat sealable multilayer film according to claim 9 , wherein the propylene polymer (H) for the laminate layer (3) has a melting point lower than that of the propylene block copolymer (C) or the propylene polymer (C) for the support layer (2).

Assignments (2)
CHANGE OF NAME Recorded Sep 15, 2012
From: TOHCELLO CO., LTD.
To: MITSUI CHEMICALS TOHCELLO INC.
Reel/Frame 028994/0234 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 13, 2010
From: TAKEISHI, ICHIRO; SHIMIZU, TAKESHI
To: TOHCELLO CO., LTD.
Reel/Frame 024835/0173 →
Priority Claims (2)
JP 2008-097632 · Apr 3, 2008 · national
JP 2008-207528 · Aug 11, 2008 · national
Continuity (1)
Related Publication 20100310890A1 · Dec 9, 2010