IP Library Granted Patent US 8,664,684
Granted Patent B2
US 8,664,684 · App. 12/872,092 · Granted Mar 4, 2014

Solid state lighting devices with improved contacts and associated methods of manufacturing

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Quick Facts
Patent No.
US 8,664,684
App. No.
12/872,092
Granted
Mar 4, 2014
Kind
B2
Abstract

Solid state lighting (“SSL”) devices with improved contacts and associated methods of manufacturing are disclosed herein. In one embodiment, an SSL device includes an SSL structure having a first semiconductor material, a second semiconductor material spaced apart from the first semiconductor material, and an active region between the first and second semiconductor materials. The SSL device also includes a first contact on the first semiconductor material and a second contact on the second semiconductor material, where the first and second contacts define the current flow path through the SSL structure. The first or second contact is configured to provide a current density profile in the SSL structure based on a target current density profile.

Claims (36)

1. A solid state lighting (“SSL”) device comprising:

a first semiconductor material;

a second semiconductor material spaced apart from the first semiconductor material;

an active region between the first and second semiconductor materials;

a contact on the first or second semiconductor material, wherein the contact includes—

a first material having a first contact resistance, wherein the first material includes an insulative material on the first semiconductor material, the insulative material having a plurality of openings extending between the first semiconductor material and a surface of the insulative material, at least one of the plurality of openings having a different shape or size from the other openings; and

a second material having a second contact resistance different than the first contact resistance, wherein the second material includes a conductive material on the insulative material, the conductive material having a first portion on the surface of the insulative material and a second portion in the openings of the insulative material; and

wherein at least one of a shape, a size, a profile, and a distribution of the first and second materials varies from one region of the SSL device to another region of the SSL device.

2. An SSL device comprising:

a first semiconductor material;

a second semiconductor material spaced apart from the first semiconductor material;

an active region between the first and second semiconductor materials;

a first contact on the first semiconductor material;

a second contact on the second semiconductor material wherein the second contact is laterally spaced apart from the first contact;

wherein the first contact includes a first material having a first contact resistance and a second material having a second contact resistance, the first contact resistance being different from the second contact resistance;

wherein at least one of a shape, a size, a profile, and a distribution of the first and second materials varies from one region of the SSL device to another region of the SSL device;

the first material includes an insulative material on the first semiconductor material, the insulative material having a plurality of openings extending between the first semiconductor material and a surface of the insulative material, at least one of the plurality of openings having a different shape or size from the other openings; and

the second material includes a conductive material on the insulative material, the conductive material having a first portion on the surface of the insulative material and a second portion in the openings of the insulative material.

3. An SSL device comprising:

a first semiconductor material;

a second semiconductor material spaced apart from the first semiconductor material;

an active region between the first and second semiconductor materials;

a first contact on the first semiconductor material;

a second contact on the second semiconductor material wherein the second contact is laterally spaced apart from the first contact;

wherein the first contact includes a first material having a first contact resistance and a second material having a second contact resistance, the first contact resistance being different from the second contact resistance;

wherein at least one of a shape, a size, a profile, and a distribution of the first and second materials varies from one region of the SSL device to another region of the SSL device;

the first material includes an insulative material on the first semiconductor material, the insulative material having a plurality of openings extending between the first semiconductor material and a surface of the insulative material, at least one of the plurality of openings having a different shape or size from the other openings;

the second material includes a conductive material on the insulative material, the conductive material having a first portion on the surface of the insulative material and a second portion in the openings of the insulative material;

wherein the insulative material includes—

a first region including a first number of openings; and

a second region spaced apart from the first region, wherein the second region includes a second number of openings different than the first number of openings.

4. The SSL device of claim 1 wherein:

the first material includes the insulative material on the first semiconductor material,

wherein the insulative material includes—

a first region including a first number of openings; and

a second region spaced apart from the first region, wherein the second region includes a second number of openings different than the first number of openings.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 31, 2010
From: SCHUBERT, MARTIN F.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 024914/0382 →