Semiconductor light emitting device and method of fabricating semiconductor light emitting device
View Patent ↗A semiconductor light emitting device has a support substrate, a light emitting element, and underfill material. The light emitting element includes a nitride-based group III-V compound semiconductor layer contacted via a bump on the support substrate. The underfill material is disposed between the support substrate and the light emitting element, the underfill material comprising a rib portion disposed outside of an end face of the light emitting element to surround the end surface of the light emitting element.
1. A semiconductor light emitting device, comprising:
a support substrate;
a light emitting element including a nitride-based group III-V compound semiconductor layer contacted via a bump on the support substrate; and
an underfill material disposed between the support substrate and the light emitting element in a direction to be laminated, the underfill material comprising a rib portion disposed outside of a side face of the light emitting element without contacting the side face of the light emitting element in a direction of a surface of the support substrate to surround the side surface of the light emitting element.
2. The device of claim 1 , further comprising a first resin including a fluorescent material, the first resin being disposed on the underfill material and inside of the rib portion to cover at least a portion of the end face of the light emitting element.
3. The device of claim 2 , further comprising a package which covers a surface of the light emitting element and inside of an outside end face of the rib portion, the package being made of a second resin including a fluorescent material.
4. The device of claim 1 , wherein the underfill material is an epoxy-based resin with a hardness of D60 to D85 and a viscosity of 0.8 to 14 Pa·s.
5. The device of claim 1 , wherein the rib portion has a tapered shape in which a sectional area of the rib portion becomes smaller continuously away from the light emitting element.
6. The device of claim 1 , wherein an inside wall of the rib portion is disposed opposite in parallel to a sidewall of the light emitting element.
7. The device of claim 1 , wherein the underfill material is closely disposed to the support substrate, the bump and the light emitting element.
8. The device of claim 1 , wherein the light emitting element comprises a p type electrode and an n type electrode each provided on one or another of opposite surfaces of the support substrate, the p electrode and the n electrode being contacted with the support substrate via separate bumps.
9. The device of claim 1 , wherein a light extraction surface roughly processed is provided on a surface opposite to the support substrate in the light emitting element.
10. A semiconductor light emitting device, comprising:
a support substrate;
a light emitting element including a nitride-based group III-V compound semiconductor layer contacted via a bump on the support substrate;
an underfill material disposed on the support substrate to contact the support substrate, the light emitting element and the bump, the underfill material comprising a rib portion disposed outside of an end face of the light emitting element to surround the end surface of the light emitting element;
a first resin including a fluorescent material, the first resin being disposed on the underfill material and inside of the rib portion to cover at least a portion of the end face of the light emitting element; and
a package which covers a surface of the light emitting element and inside of an outside end face of the rib portion, the package being made of a second resin including a fluorescent material.
11. The device of claim 10 , wherein the underfill material is an epoxy-based resin with a hardness of D60 to D85 and a viscosity of 0.8 to 14 Pa·s.
12. The device of claim 10 , wherein the rib portion has a tapered shape in which a sectional area of the rib portion becomes smaller continuously away from the light emitting element.
13. The device of claim 10 , wherein an inside wall of the rib portion is disposed opposite in parallel to a sidewall of the light emitting element.
14. The device of claim 10 , wherein the underfill material is closely disposed to the support substrate, the bump and the light emitting element.
15. The device of claim 10 , wherein the light emitting element comprises a p type electrode and an n type electrode each provided on one or another of opposite surfaces of the support substrate, the p electrode and the n electrode being contacted with the support substrate via separate bumps.
16. The device of claim 10 , wherein a light extraction surface roughly processed is provided on a surface opposite to the support substrate in the light emitting element.