IP Library Granted Patent US 8,786,045
Granted Patent B2
US 8,786,045 · App. 12/878,429 · Granted Jul 22, 2014

Power semiconductor devices having termination structures

Inventors: Ashok Challa (Sandy, UT); Jaegil Lee (Puchon-Si, KR); Jinyoung Jung (Kyunggi-do, KR); Hocheol Jang (Kyoungki-do, KR)
Assignee: Fairchild Semiconductor Corporation
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Quick Facts
Patent No.
US 8,786,045
App. No.
12/878,429
Granted
Jul 22, 2014
Kind
B2
Abstract

In one general aspect, a termination structure can include a plurality of pillars of a first conductivity type formed inside a termination region of a second conductivity type opposite the first conductivity type where the plurality of pillars define a plurality of concentric rings surrounding an active area of a semiconductor device. The termination structure can include a conductive field plate where the plurality of pillars includes a first pillar coupled to the conductive field plate. The termination structure can include a dielectric layer where the plurality of pillars include a second pillar insulated by the dielectric layer from a portion of the conductive field plate disposed directly above the second pillar included in the plurality of pillars.

Claims (37)

1. A termination structure, comprising:

a plurality of pillars of a first conductivity type formed inside a termination region of a second conductivity type opposite the first conductivity type, the plurality of pillars defining a plurality of concentric rings surrounding an active area of a semiconductor device;

a conductive field plate, the plurality of pillars including a first pillar coupled to the conductive field plate; and

a dielectric layer, the plurality of pillars including a second pillar insulated by the dielectric layer from a portion of the conductive field plate disposed directly above the second pillar included in the plurality of pillars.

2. The termination structure of claim 1 , wherein the conductive field plate is a first conductive field plate coupled to the first pillar, the conductive field plate is made of a conductive material that covers and is dielectrically isolated from the second pillar by the dielectric layer,

the termination structure further comprising:

a second conductive field plate coupled to a third pillar from the plurality of pillars.

3. The termination structure of claim 1 , wherein the conductive field plate is coupled to ground.

4. The termination structure of claim 1 , wherein a center-to-center spacing between each pair of adjacent pillars from the plurality of pillars varies with a distance from an edge of the active area.

5. The termination structure of claim 1 , wherein a center-to-center spacing between each pair of adjacent pillars from the plurality of pillars increases with a distance from an edge of the active area.

6. The termination structure of claim 1 , wherein a width of each pillar from the plurality of pillars varies with a distance from an edge of the active area.

7. The termination structure of claim 1 , wherein a width of each pillar from the plurality of pillars decreases with a distance from an edge of the active area.

8. The termination structure of claim 1 , wherein a top surface of the second pillar from the plurality of pillars is covered by the dielectric layer.

9. The termination structure of claim 1 , wherein the conductive field plate coupled to the first pillar extends over and is insulated from the second pillar from the plurality of pillars by the dielectric layer.

10. The termination structure of claim 1 , wherein the first pillar has a length at least five times greater than a width of the first pillar.

11. The termination structure of claim 1 , wherein the plurality of pillars are p-type pillars, the p-type pillars decrease in charge with distance from the active area such that a net n-type balance charge is formed in at least a portion of the termination region.

12. The termination structure of claim 1 , wherein at least a portion of the termination region of the second conductivity type is an epitaxial layer, the first pillar extends to a depth more than half of a thickness of the epitaxial layer.

13. An apparatus, comprising:

a first conductive field plate;

a second conductive field plate;

a dielectric layer; and

a plurality of pillars of a first conductivity type formed inside a termination region of a second conductivity type opposite the first conductivity type, the plurality of pillars defining a plurality of concentric rings disposed outside of an active area of a semiconductor device,

the plurality of pillars including a first pillar coupled to the first conductive field plate and including a second pillar coupled to the second conductive field plate, the plurality of pillars including a third pillar isolated from the second conductive field plate by the dielectric layer, the dielectric layer being contiguous between the first pillar included in the plurality of pillars and the second pillar included in the plurality of pillars, the plurality of pillars being p-type pillars, the p-type pillars decreasing in charge with distance from the active area such that a net n-type balance charge is formed in at least a portion of the termination region.

14. The apparatus of claim 13 , wherein at least a portion of the termination region of the second conductivity type is an epitaxial layer, the first pillar and the third pillar each extend to a depth more than half of a thickness of the epitaxial layer.

15. A termination structure, comprising:

a conductive field plate;

a plurality of pillars of a first conductivity type inside a termination region of a second conductivity type opposite the first conductivity type, the plurality of pillars defining a plurality of concentric rings surrounding an active area of a semiconductor device;

a dielectric layer, the plurality of pillars including a first pillar coupled to the conductive field plate and including a second pillar disposed between first pillar included in the plurality of pillars and a third pillar included in the plurality of pillars, the second pillar included in the plurality of pillars being isolated from the conductive field plate by the dielectric layer, the dielectric layer being contiguous between the first pillar included in the plurality of pillars and the third pillar included in the plurality of pillars;

a first mesa region disposed between the first pillar included in the plurality of pillars and the second pillar included in the plurality of pillars; and

a second mesa region disposed between the second pillar included in the plurality of pillars and the third pillar included in the plurality of pillars, the first mesa region having a width greater than a width of the second mesa region.

16. The termination structure of claim 15 , wherein the plurality of pillars are p-type pillars, the p-type pillars decrease in charge with distance from the active area such that a net n-type balance charge is formed in at least a portion of the termination region.

17. The apparatus of claim 13 , further comprising:

a first mesa region disposed between the first pillar included in the plurality of pillars and the second pillar included in the plurality of pillars; and

a second mesa region disposed between the second pillar included in the plurality of pillars and the third pillar included in the plurality of pillars, the first mesa region having a width greater than a width of the second mesa region.

18. The apparatus of claim 13 , wherein the second pillar is a last pillar from the plurality of pillars.

19. The termination structure of claim 15 , wherein the plurality of pillars define a charge balance with the active area such that a breakdown voltage of the termination region is substantially equal to a breakdown voltage of the active area.

20. The termination structure of claim 15 , wherein a distance between a pair of pillars from the plurality of pillars is approximately twice a distance between the plurality of pillars and an end of an active trench in the active area.

Assignments (7)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 058871, FRAME 0799 Recorded Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 040075, FRAME 0644 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0536 →
SECURITY INTEREST Recorded Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
RELEASE OF SECURITY INTEREST Recorded Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
PATENT SECURITY AGREEMENT Recorded Sep 19, 2016
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 040075/0644 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2014
From: CHALLA, ASHOK; ELBANHAWY, ALAN; GREBS, THOMAS E.; KRAFT, NATHAN L.; PROBST, DEAN E.; RIDLEY, RODNEY S.; SAPP, STEVEN P.; WANG, QI; YUN, CHONGMAN; LEE, J.G.; WILSON, PETER H.; YEDINAK, JOSEPH A.; JUNG, J.Y.; JANG, H.C.; SANI, BABAK S.; STOKES, RICHARD; DOLNY, GARY M.; MYTYCH, JOHN; LOSEE, BECKY; SELSLEY, ADAM; HERRICK, ROBERT; MURPHY, JAMES J.; MADSON, GORDON K.; MARCHANT, BRUCE D.; REXER, CHRISTOPHER L.; KOCON, CHRISTOPHER B.; WOOLSEY, DEBRA S
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 033833/0697 →
Continuity (6)
Division 12032123 · Feb 15, 2008
Continuation 11026276 · Dec 29, 2004
Continuation In Part 10640742 · Aug 14, 2003
Continuation In Part 10442670 · May 20, 2003
Provisional Application 60533790 · Dec 30, 2003
Related Publication 20110001189A1 · Jan 6, 2011