Patent Assignment
Reel/Frame 033833/0697
Assignment of Assignor's Interest
Recorded: 2014-09-26
Pages: 13
Assignors
CHALLA, ASHOK
Executed: 2005-03-24
ELBANHAWY, ALAN
Executed: 2005-03-30
GREBS, THOMAS E.
Executed: 2005-03-18
KRAFT, NATHAN L.
Executed: 2005-03-18
PROBST, DEAN E.
Executed: 2005-03-29
RIDLEY, RODNEY S.
Executed: 2005-03-18
SAPP, STEVEN P.
Executed: 2005-03-31
WANG, QI
Executed: 2005-03-23
YUN, CHONGMAN
Executed: 2005-03-16
LEE, J.G.
Executed: 2005-03-16
WILSON, PETER H.
Executed: 2005-03-17
YEDINAK, JOSEPH A.
Executed: 2005-03-18
JUNG, J.Y.
Executed: 2005-03-16
JANG, H.C.
Executed: 2005-03-16
SANI, BABAK S.
Executed: 2005-04-08
STOKES, RICHARD
Executed: 2005-03-18
DOLNY, GARY M.
Executed: 2005-03-30
MYTYCH, JOHN
Executed: 2005-03-21
LOSEE, BECKY
Executed: 2005-03-24
SELSLEY, ADAM
Executed: 2005-03-02
HERRICK, ROBERT
Executed: 2005-03-24
MURPHY, JAMES J.
Executed: 2005-03-29
MADSON, GORDON K.
Executed: 2005-03-24
MARCHANT, BRUCE D.
Executed: 2005-03-28
REXER, CHRISTOPHER L.
Executed: 2005-03-18
KOCON, CHRISTOPHER B.
Executed: 2005-03-17
WOOLSEY, DEBRA S
Executed: 2005-03-24
Assignee
FAIRCHILD SEMICONDUCTOR CORPORATION
82 RUNNING HILL ROAD, MS 35-4E, SOUTH PORTLAND, MAINE, 04106
Covered Properties
(6)
Methods of Forming Inter-Poly Dielectric (Ipd) Layers in Power Semiconductor Devices
Power Semiconductor Devices Having Termination Structures
Methods of Manufacturing Power Semiconductor Devices with Trenched Shielded Split Gate Transistor
Methods of Manufacturing Power Semiconductor Devices with Shield and Gate Contacts
Methods Related to Power Semiconductor Devices with Thick Bottom Oxide Layers
Accumulation-Mode Field Effect Transistor with Improved Current Capability
Related Assignments
(8)
Other recorded transfers of the patents in this record — the chain of ownership.
Patent Security Agreement
Sep 19, 2016
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 040075/0644 →
Assignment of Assignor's Interest
Oct 11, 2016
From: SHENOY, PRAVEEN MURALEEDHARAN
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 039981/0585 →
Assignment of Assignor's Interest
Aug 3, 2021
From: FAIRCHILD SEMICONDUCTOR CORPORATION
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 057694/0374 →
Release of Security Interest
Oct 28, 2021
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 057969/0206 →
Security Interest
Nov 12, 2021
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 058871/0799 →
Release of Security Interest in Patents Recorded at Reel 040075, Frame 0644
Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064070/0536 →
Release of Security Interest in Patents Recorded at Reel 058871, Frame 0799
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 065653/0001 →
Security Interest
Jul 13, 2023
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; GTAT CORPORATION
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064271/0971 →