IP Library › Granted Patent US 8,363,413
Granted Patent B2
US 8,363,413 · App. 12/880,350 · Granted Jan 29, 2013

Assembly to provide thermal cooling

Inventors: Jeffrey Paquette (Wakefield, MA); Scott R. Cheyne (Brookline, NH); Joseph R. Ellsworth (Worcester, MA)
Assignee: Raytheon Company
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Quick Facts
Patent No.
US 8,363,413
App. No.
12/880,350
Granted
Jan 29, 2013
Kind
B2
Abstract

In one aspect, an assembly to provide thermal cooling includes a first member having a first channel configured to receive a cooling fluid, a second member having a second channel configured to receive the cooling fluid and a first plurality of hollow and flexible conduits connecting the first and second members. Each of the first plurality of hollow and flexible conduits is configured to provide a path for the cooling fluid to flow between the first and second channels.

Claims (19)

1. An active, electronically scanned array (AESA) panel architecture system comprising:

a first daughter board comprising antenna elements;

a first thermal spreader attached to the antenna elements of the first daughter board;

a second daughter board comprising antenna elements;

a second thermal spreader attached to the antenna elements of the second daughter board;

a board assembly comprising:

a mother board; and

an RF interface board attached to the mother board and in direct contact with the first and second daughter boards;

a cold-plate assembly in direct contact with the first thermal spreader and the second thermal spreader and comprising:

a first cold-plate having a first channel configured to receive a cooling fluid;

a second cold-plate having a second channel configured to receive the cooling fluid and in direct contact with the first thermal spreader;

a third cold-plate having a third channel configured to receive the cooling fluid and in direct contact with the second thermal spreader;

a first plurality of hollow and flexible conduits connecting the first and second cold-plates, each of the first plurality of hollow and flexible conduits configured to provide a path for the cooling fluid to flow between the first and second channels; and

a second plurality of hollow and flexible conduits connecting the first and third cold-plates, each of the second plurality of hollow and flexible conduits configured to provide a path for the cooling fluid to flow between the first and third channels.

2. The system of claim 1 wherein at least one of the first plurality of hollow and flexible conduits is one of a flexible bellow, a hose or a sliding rigid tube.

3. The system of claim 1 , further comprising a boss attached to the first member and extending through the daughter card, the thermal spreader to the board assembly.

4. The system of claim 3 , wherein the boss includes threads, and further comprising a fastener secures the board assembly by engaging the threads of the boss.

5. The system of claim 1 , further comprising a spring disposed between the first and second cold-plates.

6. The system of claim 5 , wherein the first plate includes threads, and further comprising a fastener attaching the board assembly to the first cold-plate by engaging the threads on the first cold-plate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2010
From: PAQUETTE, JEFFREY; CHEYNE, SCOTT R.; ELLSWORTH, JOSEPH R.
To: RAYTHEON COMPANY
Reel/Frame 024977/0281 →
Continuity (1)
Related Publication 20120063098A1 · Mar 15, 2012