IP Library Granted Patent US 8,093,671
Granted Patent B2
US 8,093,671 · App. 12/880,458 · Granted Jan 10, 2012

Semiconductor device with a bulk single crystal on a substrate

Assignee: Kromek Limited
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,093,671
App. No.
12/880,458
Granted
Jan 10, 2012
Kind
B2
Abstract

Device and method of forming a device in which a substrate ( 10 ) is fabricated with at least part of an electronic circuit for processing signals. A bulk single crystal material ( 14 ) is formed on the substrate, either directly on the substrate ( 10 ) or with an intervening thin film layer or transition region ( 12 ). A particular application of the device is for a radiation detector.

Claims (8)

1. A radiation detector device for detection of high energy photons comprising a substrate fabricated with at least part of an electronic circuit for processing electrical signals, and a bulk single crystal material suitable for absorbing the high energy photons and generating the electrical signals deposited epitaxially onto the substrate such that the electrical signals generated within the bulk single crystal material pass through the bulk single crystal material to the underlying substrate to be processed by the electronic circuit within the substrate, in which the bulk single crystal material comprises cadmium telluride, cadmium zinc telluride, or cadmium manganese telluride, and the device is suitable for detection of x-rays, gamma rays, or both x-rays and gamma rays.

2. The device of claim 1 , in which the substrate is formed from a silicon or gallium arsenide material.

3. The device of claim 1 , in which the electronic circuit includes an application-specific integrated circuit.

4. The device of claim 3 , in which the application-specific integrated circuit includes components selected from the group of transistors, diodes, charge coupled devices, resistors and capacitors.

5. The device of claim 1 , further including metal contact regions provided on the a surface of the substrate.

6. The device of claim 1 , further comprising an interfacial region between the substrate and bulk single crystal material.

7. The device of claim 1 , further comprising a metal layer provided on or over the bulk single crystal material.

8. The device of claim 1 , in which the bulk single crystal material has a thickness of from 0.007 cm to 3.5 cm.

Assignments (2)
CHANGE OF NAME Recorded Mar 14, 2011
From: DURHAM SCIENTIFIC CRYSTALS LIMITED
To: KROMEK LIMITED
Reel/Frame 025946/0739 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2010
From: BASU, ARNAB; ROBINSON, MAX; CANTWELL, BEN; BRINKMAN, ANDY
To: DURHAM SCIENTIFIC CRYSTALS LIMITED
Reel/Frame 024976/0854 →
Priority Claims (1)
GB 0526072.4 · Dec 21, 2005 · national
Continuity (2)
Division 12158111
Related Publication 20100327277A1 · Dec 30, 2010