IP Library Granted Patent US 8,390,066
Granted Patent B2
US 8,390,066 · App. 12/881,593 · Granted Mar 5, 2013

Semiconductor nanowire memory device

Inventors: Hideyuki Nishizawa (Tokyo, JP); Satoshi Itoh (Ibaraki, JP)
Assignee: Kabushiki Kaisha Toshiba
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Quick Facts
Patent No.
US 8,390,066
App. No.
12/881,593
Granted
Mar 5, 2013
Kind
B2
Abstract

According to an embodiment, a semiconductor memory device capable of stably operating even when an element is shrunk is provided. The semiconductor memory device of the embodiment includes: first and second diodes serially connected between power sources of two different potentials, formed by nanowires, and exhibiting negative differential resistances; and a select transistor connected between the first diode and the second diode. The nanowires are preferably silicon nanowires. The thickness of the silicon nanowires is preferably 8 nm or less.

Claims (14)

1. A semiconductor memory device comprising:

first and second diodes serially connected between power sources of two different potentials, the diodes being formed by non-doped silicon nanowires or non-doped germanium nanowires, the diodes having a thickness of 10 nm or less, and exhibiting negative differential resistances; and

a select transistor connected between the first diode and the second diode.

2. The device according to claim 1 , wherein the nanowires are silicon nanowires.

3. The device according to claim 2 , wherein a thickness of the silicon nanowires is 8 nm or less.

4. The device according to claim 2 , wherein the silicon nanowires are formed in an SOI layer of an SOI substrate.

5. A semiconductor memory device comprising:

first and second diodes serially connected between power sources of two different potentials, the diodes being formed by non-doped silicon nanowires or non-doped germanium nanowires, the diodes having a thickness of 10 nm or less, and exhibiting negative differential resistances;

a select transistor, a drain electrode of the select transistor being connected between the first diode and the second diode;

a data line being connected to a source electrode of the select transistor; and

an address line being connected to a gate electrode of the select transistor.

6. The device according to claim 5 , wherein the nanowires are silicon nanowires.

7. The device according to claim 6 , wherein a thickness of the silicon nanowires is 8 nm or less.

8. The device according to claim 6 , wherein the silicon nanowires are formed in an SOI layer of an SOI substrate.

Assignments (4)
MERGER Recorded Jan 31, 2020
From: TOSHIBA MEMORY CORPORATION; K.K PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051679/0042 →
DE-MERGER Recorded Jan 31, 2020
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051762/0119 →
CHANGE OF NAME AND ADDRESS Recorded Jan 31, 2020
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 051762/0197 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 5, 2010
From: NISHIZAWA, HIDEYUKI; ITOH, SATOSHI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 025317/0859 →
Priority Claims (1)
JP 2010-057549 · Mar 15, 2010 · national
Continuity (1)
Related Publication 20110220876A1 · Sep 15, 2011