Printed circuit board module enclosure and apparatus using same
A modular electronic component includes a circuit board having disposed thereon one or more electronic components and an enclosure for housing the circuit board. The enclosure comprises a thermally conductive shell having front and back surfaces being substantially parallel to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, left and right surfaces being substantially perpendicular to the plane of the circuit board and being disposed on opposite sides of the circuit board from each other, and top and bottom surfaces being substantially perpendicular to the left and right surfaces and substantially perpendicular to the top and bottom surfaces and being disposed on opposite sides of the circuit board from each other. A thermal shunt comprised of a thermally conductive material is disposed between the circuit board and the front surface of the enclosure and provides a thermally conductive path between at least some of the electronic components and the front surface of the enclosure, where the front surface of the enclosure conducts heat to at least one of the top, left, and right surfaces of the enclosure.
1. A modularly pluggable electronic component system, comprising:
a chassis for housing a plurality of modules that house circuit boards, each module comprising a thermally conducting enclosure having front, back, left, right, and top surfaces;
a backplane disposed within a lower portion of the chassis for providing one or more electrical connections to the modules, the backplane having upward-facing electrical connectors for connecting to downward-facing electrical connectors disposed along the bottom surface of the modules that are inserted downward into the chassis; and
heat dissipation means being in physical contact with and for conducting heat away from the at least one of the top, left, and right surfaces of the modules, wherein the heat dissipation means comprises a compression loaded side plate heat spreader.
2. The modularly pluggable electronic component system of claim 1 including a module for housing circuit boards, wherein the module for housing circuit boards comprises a circuit board secured within the module enclosure and includes at least one electrical connector, disposed within the bottom surface of the module, for connecting to at least one of the upward-facing electrical connectors on the backplane.
3. The modularly pluggable electronic component system of claim 1 wherein the heat dissipation means comprises a heat sink.
4. The modularly pluggable electronic component system of claim 3 wherein the heat sink includes fins for radiating heat.
5. The modularly pluggable electronic component system of claim 1 wherein the inserted modules are stacked along an axis through the front and back surfaces of the modules.
6. The modularly pluggable electronic component system of claim 1 wherein the modules are interlocked within the chassis.
7. The modularly pluggable electronic component system of claim 2 wherein the plane of the circuit board within the module is substantially parallel with the plane of the front and back surfaces of the module, wherein the circuit board includes one or more components, and wherein the front surface of the module provides a path to conduct heat from the one or more components to at least one of the top, left, and right surfaces of the module.
8. A modularly pluggable electronic component system comprising:
a chassis for housing a plurality of modules that house circuit boards, each module comprising a thermally conducting enclosure having front, back, left, right, and top surfaces;
a backplane disposed within a lower portion of the chassis for providing one or more electrical connections to the modules, the backplane having upward-facing electrical connectors for connecting to downward-facing electrical connectors disposed along the bottom surface of the modules that are inserted downward into the chassis; and
heat dissipation means being in physical contact with and for conducting heat away from the at least one of the top, left, and right surfaces of the modules,
wherein the chassis comprises a tray for mounting the backplane and for providing alignment to the modules.
9. The modularly pluggable electronic component system of claim 8 wherein the tray walls include guides for aligning modules during insertion of the modules and for maintaining the position of the modules within the chassis.
10. A modularly pluggable electronic component system comprising:
a chassis for housing a plurality of modules that house circuit boards, each module comprising a thermally conducting enclosure having front, back, left, right, and top surfaces;
a backplane disposed within a lower portion of the chassis for providing one or more electrical connections to the modules, the backplane having upward-facing electrical connectors for connecting to downward-facing electrical connectors disposed along the bottom surface of the modules that are inserted downward into the chassis;
heat dissipation means being in physical contact with and for conducting heat away from the at least one of the top, left, and right surfaces of the modules; and
means for orienting the modules to the chassis.
11. The modularly pluggable electronic component system of claim 10 wherein means for orienting the modules to the chassis comprises at least one of:
conical or beveled structures proximate to the backplane connectors for engaging in receptacles disposed within the bottom surface of the modules; and
conical or beveled structures disposed on the bottom surface of each module for engaging in receptacles proximate to the backplane connectors.
12. The modularly pluggable electronic component system of claim 10 wherein means for orienting the modules to the chassis comprises means for positioning modules in a predetermined orientation or location with respect to each other.
13. A modularly pluggable electronic component system comprising:
a chassis for housing a plurality of modules that house circuit boards, each module comprising a thermally conducting enclosure having front, back, left, right, and top surfaces;
a backplane disposed within a lower portion of the chassis for providing one or more electrical connections to the modules, the backplane having upward-facing electrical connectors for connecting to downward-facing electrical connectors disposed along the bottom surface of the modules that are inserted downward into the chassis; and
heat dissipation means being in physical contact with and for conducting heat away from the at least one of the top, left, and right surfaces of the modules, wherein the heat dissipation means comprises a heat sink, and wherein the heat sink contains a recirculating liquid and/or gas.