Integrated MEMS and ESD protection devices
An electronic apparatus is provided that has a core, an electronic circuit in the core and a lid. An ESD protection device is in the lid. The ESD protection device is coupled to the electronic circuit.
1. A MEMS system, comprising:
a base;
a semiconductor core including a MEMS device;
an electronic circuitry in the core;
a lid; and
an ESD protection device coupled to the lid and to the electronic circuitry, wherein the ESD protection device and the MEMS device are in separate wafers and the ESD protection device is integrated with the MEMS device to provide ESD protection to the MEMS device at the instant fabrication of the MEMS device is completed.
2. The system of claim 1 , wherein the MEMS device is selected from at least one of, a sensor 18 , an actuator and electronic circuitry.
3. The system of claim 1 , wherein the MEMS system provides for at least one of, integration of signal conditioning and integration of electronic circuitry.
4. The system of claim 1 , wherein the electronic circuitry is selected from at least one of, an amplifier, a filter, an A/D converter, an ASIC, a DSP, and a microprocessor.
5. The system of claim 1 , wherein the ESD protection device 22 is included in the lid.
6. The system of claim 1 , wherein the ESD protection device is one or more diodes.
7. The system of claim 6 , wherein the at least one or more diodes are diodes with a common point where ESD energy is diverted.
8. The system of claim 6 , wherein four p-n junction diodes are connected together at one end to a common point with each diode being coupled to a terminal of the MEMS device.
9. The system of claim 1 , further comprising:
vias formed in the lid 16 with metal in the vias that couple the ESD protection device with the electronic circuit.
10. The system of claim 1 , wherein further comprising:
a trim resistor network in the lid to provide for trimming of zero offset of the MEMS device.
11. The system of claim 10 , further comprising:
one or more resistors to allow for zero offset trimming.
12. The system of claim 1 , wherein a signal conditioning circuit is fabricated into the lid.
13. The system of claim 1 , wherein the MEMS device is selected from at least one of a, piezoresistive pressure sensor, accelerometer sensor, inclinometer, geophone, microphone, gyroscope, flow sensor, displacement sensor, force sensor, torque sensor, stress and strain sensor.