Devices, structures, and methods using self-aligned resistive source extensions
View Patent ↗Devices, structures, and related methods for IGBTs and the like which include a self-aligned series resistance at the source-body junction to avoid latchup. The series resistance is achieved by using a charged dielectric, and/or by using a dielectric which provides a source of dopant atoms of the same conductivity type as the source region, at a sidewall adjacent to the source region.
1. A field-effect-gated bipolar active device, comprising:
a source region having a first conductivity type;
a body region having a second conductivity type, and surrounding said source region;
a gate which is capacitively coupled to said body region, to thereby create a channel portion therein which allows passage of majority carriers from said source region;
a source extension region which connects said source region to said channel, and is more resistive than said source region;
a drift/drain region which has said first conductivity type, and which is interposed between said body region and a second-conductivity-type collector region;
wherein said source extension region is generated by a dielectric layer which contains immobile net electrostatic charge;
wherein said source extension region has the same predominant dopant type as said body region, but is in inversion.
2. The device of claim 1 , wherein said first conductivity type is n-type.
3. The device of claim 1 , wherein said dielectric layer is inhomogeneous.
4. The device of claim 1 , wherein said dielectric layer is primarily composed of silicon dioxide.
5. The device of claim 1 , wherein said body region and said drift/drain region consist primarily of silicon.
6. The device of claim 1 , wherein said gate and said channel are substantially planar.
7. The device of claim 1 , wherein said gate is a trench gate, and said channel is substantially vertical.
8. The device of claim 1 , wherein said gate is isolated from said body by a grown dielectric layer.
9. The device of claim 1 , wherein said gate is a patterned thin film layer, and said dielectric layer is a filament which runs along at least some sidewalls of said gate.
10. A semiconductor device structure, comprising:
a source region having a first conductivity type;
a body region having a second conductivity type, and surrounding said source region;
a gate which is capacitively coupled to said body region, to thereby create a channel portion therein which allows passage of majority carriers from said source region;
a source extension region which connects said source region to said channel, and is more resistive than said source region;
a drift/drain region having said first conductivity type, and interposed between said body region and a second-conductivity-type collector region;
a first metallization layer connected to said source region and to a second-conductivity-type emitter region which is connected to said body region; and
a second metallization layer which is connected to said collector region;
wherein said source extension region is generated by a dielectric layer which contains immobile net electrostatic charge;
wherein said source extension region has the same predominant dopant type as said body region, but is in inversion.
11. The device of claim 10 , wherein said first conductivity type is n-type.
12. The device of claim 10 , wherein said gate is a trench gate, and said channel is substantially vertical.
13. The device of claim 10 , wherein said gate is a patterned thin film layer, and said dielectric layer is a filament which runs along at least some sidewalls of said gate.
14. A field-effect-gated bipolar active device, comprising:
a source region having a first conductivity type;
a body region having a second conductivity type, and surrounding said source region;
a gate which is capacitively coupled to said body region, to thereby create a channel portion therein which allows passage of majority carriers from said source region;
a source extension region which connects said source region to said channel, and has said first conductivity type, and is more resistive than said source region;
a drift/drain region which has said first conductivity type, and which is interposed between said body region and a second-conductivity-type collector region;
wherein said source extension region lies under a dielectric layer which contains dopant atoms which predominantly correspond to said first conductivity type.
15. The device of claim 14 , wherein said gate and said channel are substantially planar.