IP Library Granted Patent US 8,405,155
Granted Patent B2
US 8,405,155 · App. 12/888,430 · Granted Mar 26, 2013

Semiconductor structure with gate structure, source/drain region and recess filling with epitaxial layer

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Quick Facts
Patent No.
US 8,405,155
App. No.
12/888,430
Granted
Mar 26, 2013
Kind
B2
Abstract

A semiconductor structure comprises a substrate, a gate structure, at least a source/drain region, a recess and an epitaxial layer. The substrate includes an up surface. A gate structure is located on the upper surface. The source/drain region is located within the substrate beside the gate structure. The recess is located within the source/drain region. The epitaxial layer fills the recess, and the cross-sectional profile of the epitaxial layer is an octagon.

Claims (17)

1. A semiconductor structure, comprising:

a substrate, including an up surface;

a gate structure, located on the up surface;

at least a source/drain region, located within the substrate beside the gate structure;

a first recess located within the source/drain region, wherein the first recess at least has a vertical sidewall, a slanted sidewall and a flat-bottomed surface, wherein the vertical sidewall is disposed directly under the gate structure; and

an epitaxial layer filling the first recess.

2. The semiconductor structure of claim 1 , wherein the flat-bottomed is parallel to the up surface.

3. The semiconductor structure of claim 1 , wherein the substrate includes a single crystalline silicon, and the crystal planes of the substrate is composed of the <100> planes, the <110> planes, and the <111> planes of the silicon.

4. The semiconductor structure of claim 3 , wherein the up surface is oriented along the <100> planes, and the slanted sidewall is along the <111> planes.

5. The semiconductor structure of claim 3 , wherein the up surface is oriented along the <110> planes, and the slanted sidewall is along the <111> planes.

6. The semiconductor structure of claim 1 , wherein the gate structure comprises a gate dielectric layer, a gate electrode located on the gate dielectric layer, and a spacer surrounding the gate electrode and the gate dielectric layer.

7. The semiconductor structure of claim 6 , wherein the vertical sidewall is located beneath the gate dielectric layer.

8. The semiconductor structure of claim 6 , wherein the vertical sidewall is located beneath the spacer.

9. The semiconductor structure of claim 1 , further comprising a second recess located within the substrate and on the side of the gate structure opposite to the first recess.

10. The semiconductor structure of claim 9 , wherein a vertical sidewall of the second recess is located beneath the gate structure.

11. The semiconductor structure of claim 10 , further comprising a gate channel within the substrate beneath the gate structure and between the slanted sidewall of the first recess and a slanted sidewall of the second recess.

12. The semiconductor structure of claim 1 , wherein top of the vertical sidewall is lower than the up surface of the substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2010
From: YEH, CHIU-HSIEN; WU, CHUN-YUAN; CHIEN, CHIN-CHENG
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 025031/0749 →