Electronic component module and method of manufacturing the electronic component module
An electronic component module includes a circuit substrate including surface mount components mounted thereon, a resin layer embedding the surface mount components, and a conductor layer provided on a surface of the resin layer, wherein a conductive post is provided on the surface mount component, and an external electrode having a ground potential provided on the surface mount component is conductively connected to the conductor layer through the conductive post, whereby the conductor layer defines a shielding layer.
1. An electronic component module comprising:
a circuit substrate;
at least one surface mount component mounted on the circuit substrate;
a resin layer arranged to cover the at least one surface mount component; and
a conductor layer provided on a surface of the resin layer; wherein at least one conductive post is provided on the at least one surface mount component;
the at least one surface mount component is conductively connected to the conductor layer through the at least one conductive post;
the at least one conductive post extends between the at least one surface component and the conductor layer and does not extend through the conductor layer; and
the at least one conductive post has a tapered shape in which a cross-sectional area of the at least one conductive post gradually decreases from a surface-mount-component side towards a conductor-layer side.
2. The electronic component module according to claim 1 , wherein the at least one conductive post is defined by a fluid conductive material that is piled up to a predetermined height and then solidified.
3. The electronic component module according to claim 1 , wherein
the at least one surface mount component includes an external electrode provided on a surface thereof opposite a circuit substrate side; and
the at least one conductive post is arranged so as to be conductively connected to the external electrode.
4. The electronic component module according to claim 3 , wherein the external electrode has a ground potential and is conductively connected to the conductor layer through the at least one conductive post.
5. The electronic component module according to claim 3 , wherein
the external electrode is a feeding electrode connected to an antenna; and
the external electrode is conductively connected to the conductor layer through the at least one conductive post.
6. The electronic component module according to claim 3 , wherein
the external electrode is an input/output terminal connected to a mother board; and
the external electrode is conductively connected to the conductor layer through the at least one conductive post.
7. The electronic component module according to claim 1 , wherein
the surface mount component is a heat generating surface mount component; and
the surface mount component is conductively connected to the conductor layer through the at least one conductive post.