IP Library Patent Application 12889428
Patent Application
App. No. 12/889,428

POLYMER CORE WIRE

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Patent No.
US None
App. No.
12/889,428
Abstract

A wire capable of conducting electrical current has a polymer core and a coating layer surrounding the core. The coating layer, which may be, for example, gold or copper, conducts electrical current and the core provides strength so that the wire is able to withstand bending and breakage. Among other things, the polymer core wire is useful for connecting an integrated circuit to a lead frame or substrate.

Claims (29)

1 . A wire for conducting an electrical current, comprising:

a non-conductive core; and

a coating layer formed over the non-conductive core, wherein the coating layer conducts electrical current.

2 . The wire of claim 1 , wherein the non-conductive core comprises a polymer.

3 . The wire of claim 2 , wherein the polymer comprises divinylbenzene.

4 . The wire of claim 1 , wherein the non-conductive core comprises hair.

5 . The wire of claim 1 , wherein the non-conductive core comprises carbon nanotubes.

6 . The wire of claim 1 , wherein the coating layer comprises a conductive metal plated over the non-conductive core.

7 . The wire of claim 6 , wherein the conductive metal comprises one of Gold, Copper, Aluminum and solder.

8 . The wire of claim 6 , wherein the non-conductive core is pre-plated with a conductive metal, wherein the pre-plating metal is disposed between the non-conductive core and the coating layer.

9 . The wire of claim 8 , wherein the pre-plating metal comprises Nickel or Palladium.

10 . A wire for conducting an electrical current, comprising:

a non-conductive core;

a first metal layer pre-plated over the core; and

a second metal layer plated over the pre-plated layer, wherein the first and second metal layers conduct electrical current.

11 . The wire of claim 10 , wherein the wire has an overall thickness of between about 30 um and 275 um.

12 . A method of making a wire capable of conducting an electrical current, the method comprising the steps of:

providing a length of non-conductive material; and

plating a first conductive metal over the non-conductive material.

13 . The method of making a wire of claim 12 , further comprising the step of pre-plating the non-conductive material with a second conductive metal before performing the plating step.

14 . The method of making a wire of claim 13 , wherein the second conductive metal comprises one of Nickel and Palladium.

15 . The method of making a wire of claim 14 , wherein the first conductive metal comprises one of Gold, Copper, Aluminum and solder.

16 . The method of making a wire of claim 12 , wherein the non-conductive material comprises a polymer.

17 . The method of making a wire of claim 12 , wherein the non-conductive material comprises hair.

18 . The method of making a wire of claim 12 , wherein the non-conductive material comprises carbon nanotubes.

19 . The method of making a wire of claim 12 , wherein the plating step comprises one of electroless and electrolytic plating of Copper over the non-conductive core material.

20 . The method of making a wire of claim 12 , further comprising the steps of:

winding the plated, non-conductive material around a spool; and

unwinding and annealing the plated non-conductive material.

Assignments (16)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0285 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0387 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0334 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0075 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027621/0928 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0477 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 24, 2010
From: LO, WAI YEW; LEE, YIT MENG; TAN, LAN CHU
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 025035/0562 →