Granted Patent B2

US 8,890,324 · App. 12/892,622 · Granted Nov 18, 2014

Abstract

Claims (27)

1. A structure having a semiconductor substrate, comprising:

an opening in the substrate having depth from a top surface of the substrate to a bottom surface of the substrate; and

a conductive material filling the opening;

wherein the opening:

has a length direction and a width direction, wherein the width direction is substantially perpendicular to the length direction;

has a first feature and a second feature spaced apart by a first length, wherein the first length is substantially parallel to the length direction, and wherein the first feature has a first width as a maximum width of the first feature and the second feature has a second width as the maximum width of the second feature; and

has a minimum width located between the first feature and the second feature that is no more than one fifth the first length, wherein the first width and the second width are each at least twice the minimum width, wherein each of the first width, the second width, and the minimum width is substantially parallel to the width direction.

2. The structure of claim 1 , further comprising:

a third feature spaced from the second feature by a second length, wherein the third feature has a third width as a maximum width of the third feature, the third width is at least twice the minimum width, and the minimum width is no more than one fifth the second length.

3. The structure of claim 2 , wherein the first feature is at a first end of the opening and the third feature is at a second end of the opening.

4. The structure of claim 1 , wherein the first feature is at a first end of the opening and the second feature is at a second end of the opening.

5. The structure of claim 1 , wherein the first feature has a length less than the first width.

6. The structure of claim 1 , wherein the first feature has a substantially rectangular shape.

7. The structure of claim 1 , wherein the first feature has a substantially oval shape.

8. The structure of claim 1 , wherein the substrate comprises a semiconductor material.

9. The structure of claim 1 , wherein a ground connection is made to the conductive filling at the bottom surface of the substrate.

10. The structure of claim 1 , further comprising an interconnect layer over the conductive filling at the top surface of the substrate.

11. A structure, comprising:

a through via from a top surface of a semiconductor substrate through the substrate to a bottom surface of the substrate; and

a conductive material in the substrate forming the through via, wherein:

the conductive material has a first feature, a second feature, and a conductive line between the first feature and the second feature;

the conductive line has a minimum width at the top surface of the substrate;

the first feature and the second feature have a maximum width at the top surface of the substrate;

the conductive line has a first length at the top surface, wherein the minimum width is substantially perpendicular to the first length, and the maximum width is substantially perpendicular to the first length;

the maximum width is at least twice the minimum width; and

the first length is at least five times the minimum width.

12. The structure of claim 11 , wherein the conductive material further comprises a third feature spaced from the second feature by a second length, wherein the third feature has a third width as a maximum width of the third feature, the third width is a least twice the minimum width, and the minimum width is no more than one fifth the second length.

Assignments (20)