Semiconductor device and programming method
View Patent ↗The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.
1. A method for fabricating a semiconductor device comprising:
mounting a semiconductor chip on a chip mounting portion;
disposing a sheet-shaped resin in contact with the semiconductor chip;
coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is in contact with the sheet-shaped resin; and
forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip.
2. The method as claimed in claim 1 , wherein disposing the sheet-shaped resin comprises disposing the sheet-shaped resin on a surface of a die to seal the semiconductor chip, the surface opposing the semiconductor chip.
3. The method as claimed in claim 2 , wherein forming the resin sealing portion includes:
disposing an uncured resin between the sheet-shaped resin and the semiconductor chip; and
sealing the semiconductor chip with the uncured resin.
4. The method as claimed in clam 1 , wherein forming the resin sealing portion comprises forming the resin sealing portion by transfer molding.
5. The method as claimed in clam 1 , wherein the sheet-shaped resin does not include a filler.
6. The method as claimed in clam 1 , wherein forming the resin sealing portion comprises partially forming the resin sealing portion between the sheet-shaped resin and the semiconductor chip.
7. The method as claimed in clam 1 , wherein disposing the sheet-shaped resin comprises disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion.
8. The method as claimed in clam 1 , wherein the semiconductor chip has stacked semiconductor chips.
9. The method as claimed in clam 1 wherein the wire is partially embedded in the sheet-shaped resin.
10. A system comprising:
means for mounting a semiconductor chip on a chip mounting portion;
means for disposing the sheet-shaped resin comprises disposing the sheet-shaped resin in contact with the semiconductor chip;
means for coupling a wire between the semiconductor chip and the upper die portion, wherein the wire is provided in contact with the sheet-shaped resin;
means for forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip.
11. The system as claimed in claim 10 , wherein the disposing of the sheet-shaped resin comprises disposing the sheet-shaped resin on a surface of a die to seal the semiconductor chip, the surface opposing the semiconductor chip.
12. The method as claimed in claim 11 , wherein the means for forming the resin sealing portion includes:
means for disposing an uncured resin between the sheet-shaped resin and the semiconductor chip; and
means for sealing the semiconductor chip with the uncured resin.
13. The method as claimed in clam 10 , wherein the resin sealing portion is formed by transfer molding.
14. The method as claimed in clam 10 , wherein the sheet-shaped resin does not include a filler.
15. The method as claimed in clam 10 , wherein forming the resin sealing portion comprises partially forming the resin sealing portion between the sheet-shaped resin and the semiconductor chip.
16. The method as claimed in clam 10 , wherein the disposing of the sheet-shaped resin comprises disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion.
17. The method as claimed in clam 10 , wherein the semiconductor chip has stacked semiconductor chips.
18. A method for fabricating a semiconductor device comprising:
mounting a semiconductor chip on an upper die portion;
disposing a sheet-shaped resin on a lower die portion, wherein the sheet-shaped resin is disposed in contact with the semiconductor chip;
coupling a wire between the semiconductor chip and the upper die portion, wherein the wire is provided in contact with the sheet-shaped resin;
assembling the upper die portion and the lower die portion; and
sealing the semiconductor chip with a sealing resin, wherein the sealing resin forms a resin sealing portion between the sheet-shaped resin and the upper die portion, to seal the semiconductor chip.