Self healing high energy glass capacitors

1. A self healing high energy glass capacitor comprising:

an alkali-free glass layer having a top surface and a bottom surface;

a top sacrificial layer extending across and in contact with said top surface;

a bottom sacrificial layer extending across and in contact with said bottom surface;

a top electrode extending across said top sacrificial layer;

a bottom electrode extending across said bottom sacrificial layer; and

upon energy breakdown of said alkali-free glass layer at least one of said top sacrificial layer and said bottom sacrificial layer have a self healing property selected from the group consisting of selective ablation to promote self healing of said alkali-free glass layer, redox reacting to promote self healing of said alkali-free glass layer, and exothermic reacting to enhancing evaporation or phase change of at least one of said top electrode and said bottom electrode to clear a region around a failure location/defect and aiding in electrode removal from said fault region;

said glass capacitor has an energy breakdown of at least 6 joules per cubic centimeter.

2. The high energy glass capacitor of claim 1 , wherein said glass layer has a thickness of between 1 and 100 microns, inclusive.

3. The high energy glass capacitor of claim 1 , wherein said top sacrificial layer and said bottom sacrificial layer has a thickness of between 10 nanometers and 5 microns, inclusive.

4. The high energy glass capacitor of claim 3 , wherein said top sacrificial layer and/or said bottom sacrificial layer is an inorganic compound.

5. The high energy glass capacitor of claim 4 , wherein said inorganic compound is selected from a group consisting of a metal oxide, a metal nitride, metal nitride/oxynitride, carbide, carbide/oxynitride and combinations thereof.

6. The high energy glass capacitor of claim 3 , wherein said top sacrificial layer and/or said bottom sacrificial layer is a carbonaceous and/or graphitic compound.

7. The high energy glass capacitor of claim 3 , wherein said top sacrificial layer and/or said bottom sacrificial layer is a polymer.

8. The high energy glass capacitor of claim 1 , further comprising an interfacial bond layer between said glass layer and said top sacrificial layer and/or said bottom sacrificial layer.

9. The high energy glass capacitor of claim 8 , wherein said interfacial bond layer contains a polar molecule.

10. The high energy glass capacitor of claim 9 , wherein said polar molecule is selected from a group consisting of a high polar molecule and a low polar molecule.

11. The high energy glass capacitor of claim 9 , wherein said polar molecule is selected from a group consisting of 3-aminopropyl-triethoxysilane (APTES) and heptadecafluoro-1,1,2,2-tetrahydrodecyltrimethoxysilane (HTDF).

12. The high energy glass capacitor of claim 8 , wherein said interfacial bond layer is a polymer.

13. The high energy glass capacitor of claim 12 , wherein said polymer is bonded to said glass layer using an interfacial silane coupling agent.

14. The high energy glass capacitor of claim 12 , wherein said interfacial silane coupling agent is 3-mercapto-propyl-trimethoxy-silane (MPTMS).

15. The high energy glass capacitor of claim 1 , wherein said top surface and/or said bottom surface of said alkali-free glass layer has a root mean square (RMS) surface roughness of less than 10 nm.

16. The high energy glass capacitor of claim 1 , wherein said top surface and/or said bottom surface of said alkali-free glass layer has an RMS surface roughness of less than 6 nm.

17. The high energy glass capacitor of claim 1 , wherein said top surface and/or said bottom surface of said alkali-free glass layer has an RMS surface roughness of less than 5 nm.

18. The high energy glass capacitor of claim 1 , wherein said top surface and/or said bottom surface of said alkali-free glass layer has an RMS surface roughness of less than 4 mm.