IP Library › Granted Patent US 8,553,043
Granted Patent B2
US 8,553,043 · App. 12/905,108 · Granted Oct 8, 2013

Three-dimensional (3D) image processing method and system

Inventors: Fei Yan (Shenzhen, CN); Ning Liu (Shenzhen, CN)
Assignee: SuperD Co. Ltd.
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Quick Facts
Patent No.
US 8,553,043
App. No.
12/905,108
Granted
Oct 8, 2013
Kind
B2
Abstract

A three-dimensional (3D) image processing method is provided. The method includes receiving from an image source a 3D image containing a plurality of images that are previously compressed, and storing pixel data of the received plurality of images. The method also includes determining that the plurality of images do not have a same number of pixel columns, determining at least one boundaries among the plurality of images, and determining a minimum number of pixel columns and a maximum number of pixel columns of the plurality of images. Further, the method includes adjusting any one of the plurality of images having a column number less than the maximum number such that each of the plurality of images has the maximum number of pixel columns, decompressing the plurality of images, and discarding from each of the decompressed plurality of images by a determined number of last columns, wherein the determined number is the difference between the maximum number and the minimum number.

Claims (66)

1. A three-dimensional (3D) image processing method, comprising:

receiving from an image source a 3D image containing a plurality of images previously compressed, wherein the plurality of images are from different viewpoints of the 3D image with certain parallax and transmitted in a single frame;

storing pixel data of the received plurality of images;

determining that the plurality of images of the 3D image do not have a same number of pixel columns;

determining at least one boundaries between the plurality of images of the 3D image;

determining a minimum number of pixel columns and a maximum number of pixel columns of the plurality of images of the 3D image in the single frame based on the at least one boundaries between the plurality of images of the 3D image;

adjusting any one of the plurality of images of the 3D image having a column number less than the maximum number such that each of the plurality of images of the 3D image has the maximum number of pixel columns;

decompressing the plurality of images of the 3D image; and

discarding from each of the decompressed plurality of images of the 3D image by a determined number of last columns, wherein the determined number is the difference between the maximum number and the minimum number.

2. The method according to claim 1 , wherein determining the boundaries further includes:

determining the at least one boundaries between the plurality of images of the 3D image based on a register, wherein the register records a number of pixel columns of each of the plurality of images.

3. The method according to claim 1 , wherein

the plurality of images of the 3D image include a first image and a second image.

4. The method according to claim 3 , wherein storing further includes:

when received pixel data is from the first image or pixels before the first image, storing the received pixel data in a first storage unit of a register; and

when the received pixel data is from the second image or pixels after the second image, storing the received pixel data in a second storage unit of the register.

5. The method according to claim 1 , wherein adjusting further includes:

determining a current column number of one of the plurality of images of the 3D image;

determining a required number of columns to be added as the difference between the maximum number and the current column number;

duplicating the last required number of columns of the one of the plurality of images; and

adding the duplicated last required number of columns to the one of the plurality of images to have the maximum number of columns.

6. The method according to claim 1 , wherein:

the plurality of images of the 3D image are compressed horizontally.

7. The method according to claim 1 , wherein:

a total number of pixel columns of the plurality of images is an odd number.

8. A three-dimensional (3D) display system, comprising:

a source image providing module configured to provide a 3D image containing a plurality of images previously compressed, wherein the plurality of images are from different viewpoints of the 3D image with certain parallax and transmitted in a single frame;

a register configured to:

determine at least one boundaries between the plurality of images of the 3D image; and

determine a minimum number of pixel columns and a maximum number of pixel columns of the plurality of images of the 3D image in the single frame based on the at least one boundaries between the plurality of images of the 3D image; and

a microprocessing unit configured to

adjust any one of the plurality of images of the 3D image having a column number less than the maximum number such that each of the plurality of images has the maximum number of pixel columns;

decompress the plurality of images of the 3D image; and

discard from each of the decompressed plurality of images of the 3D image by a determined number of last columns, wherein the determined number is the difference between the maximum number and the minimum number.

9. The 3D display system according to claim 8 , wherein

the register is a programmable register.

10. The 3D display system according to claim 8 , wherein the plurality of images include a first image and a second image, and the register is further configured to:

when received pixel data is from the first image or pixels before the first image, store the received pixel data in a first storage unit; and

when the received pixel data is from the second image or pixels after the second image, store the received pixel data in a second storage unit.

11. The 3D display system according to claim 8 , wherein, to adjust any one of the plurality of images, the microprocessing unit is further configured to:

determine a current column number of one of the plurality of images of the 3D image;

determine a required number of columns to be added as the difference between the maximum number and the current column number;

duplicate the last required number of columns of the one of the plurality of images of the 3D image; and add the duplicated last required number of columns to the one of the plurality of images of the 3D image to have the maximum number of columns.

12. The 3D display system according to claim 8 , wherein:

the plurality of images of the 3D image are compressed horizontally.

13. A semiconductor chip, comprising:

an input interface configured to receive a three-dimensional (3D) image containing a plurality of images previously compressed, wherein the plurality of images are from different viewpoints of the 3D image with certain parallax and transmitted in a single frame;

a register configured to:

determine at least one boundaries between the plurality of images of the 3D image; and

determine a minimum number of pixel columns and a maximum number of pixel columns of the plurality of images of the 3D image in the single frame based on the at least one boundaries between the plurality of images of the 3D image; and

a microprocessing unit configured to

adjust any one of the plurality of images of the 3D image having a column number less than the maximum number such that each of the plurality of images of the 3D image has the maximum number of pixel columns;

decompress the plurality of images of the 3D image; and

discard from each of the decompressed plurality of images of the 3D image by a determined number of last columns, wherein the determined number is the difference between the maximum number and the minimum number.

14. The semiconductor chip according to claim 13 , wherein

the register is a programmable register.

15. The semiconductor chip according to claim 13 , wherein the plurality of images of the 3D image include a first image and a second image, and the register is further configured to:

when received pixel data is from the first image or pixels before the first image, store the received pixel data in a first storage unit; and

when the received pixel data is from the second image or pixels after the second image, store the received pixel data in a second storage unit.

16. The semiconductor chip according to claim 13 , wherein, to adjust any one of the plurality of images, the microprocessing unit is further configured to:

determine a current column number of one of the plurality of images of the 3D image;

determine a required number of columns to be added as the difference between the maximum number and the current column number;

duplicate the last required number of columns of the one of the plurality of images of the 3D image; and

add the duplicated last required number of columns to the one of the plurality of images of the 3D image to have the maximum number of columns.

17. The semiconductor chip according to claim 13 , wherein:

the plurality of images of the 3D image are compressed horizontally.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2018
From: SHENZHEN SUPER PERFECT OPTICS LIMITED
To: SUPERD TECHNOLOGY CO., LTD.
Reel/Frame 046279/0032 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 16, 2010
From: YAN, FEI; LIU, NING
To: SHENZHEN SUPER PERFECT OPTICS LIMITED
Reel/Frame 025376/0032 →
Priority Claims (1)
CN 2010 1 0226217 · Jul 14, 2010 · national
Continuity (1)
Related Publication 20120013600A1 · Jan 19, 2012