Systems and methods for sensing properties of a workpiece and embedding a photonic sensor in metal
View Patent ↗Systems and methods for sensing properties of a workpiece and embedding a photonic sensor in metal are disclosed herein. In some embodiments, systems for sensing properties of a workpiece include an optical input, a photonic device, an optical detector, and a digital processing device. The optical input provides an optical signal at an output of the optical input. The photonic device is coupled to the workpiece and to the output of the optical input. The photonic device generates an output signal in response to the optical signal, wherein at least one of an intensity of the output signal and a wavelength of the output signal depends on at least one of thermal characteristics and mechanical characteristics of the workpiece. The optical detector receives the output signal from the photonic device and is configured to generate a corresponding electronic signal. The digital processing device is coupled to the optical detector and determines at least one of the thermal characteristics and mechanical the characteristics of the workpiece based on the electronic signal.
1. A method of embedding a photonic sensor in metal, the method comprising:
depositing at least one first optically insulating layer on a substrate;
depositing and patterning at least one waveguide material on the first optically insulating layer to define the photonic sensor;
depositing and patterning at least one second optically insulating layer over the photonic sensor;
depositing at least one first metal layer over the at least one second optically insulating layer;
etching the substrate to free the first and second optically insulating layers, the photonic sensor, and the at least one first metal layer from the substrate so as to expose a surface of the at least one first optically insulating layer;
depositing at least one second metal layer over the exposed surface of the at least one first optically insulating layer so as to substantially embed the photonic sensor and first and second optically insulating layers between the first and second metal layers.
2. The method of claim 1 , wherein patterning the waveguide material comprises at least one of lithography and etching.
3. The method of claim 1 , wherein the optically insulating layers are formed from SiO 2 .
4. The method of claim 1 , wherein the optically insulating layers are deposited by plasma enhanced vapor deposition.
5. The method of claim 1 , wherein the at least one waveguide material is Si x N y .
6. The method of claim 1 , wherein the at least one waveguide material is SiO x N y .
7. The method of claim 1 , wherein the at least one waveguide material is deposited by plasma enhanced vapor deposition.
8. The method of claim 1 , wherein the first and second metal layers are formed from Ni or Ti, or combinations thereof.
9. The method of claim 1 , wherein the first and second metal layers are deposited by electroplating.
10. The method of claim 1 , wherein the photonic sensor is configured for operation only in a transverse electric polarization.
11. The method of claim 1 , wherein the photonic sensor is configured for operation only in a transverse magnetic polarization.
12. The method of claim 1 , further comprising embedding at least one photonic sensor at select locations within a computer chip or mechanical product.
13. The method of claim 12 , further comprising annealing the embedded photonic sensor.
14. The method of claim 1 , wherein the photonic sensor is configured to measure strain.
15. The method of claim 1 , wherein the photonic sensor is configured to measure temperature.
16. The method of claim 1 , wherein a plurality of photonic sensors are manufactured in a batch process.
17. The method of claim 1 , wherein the first and second metal layers are deposited by laser deposition.
18. The method of claim 1 , wherein the photonic sensor is a photonic crystal resonator.