Semiconductor chip device with liquid thermal interface material
A method of manufacturing is provided that includes providing a semiconductor chip device that has a circuit board and a first semiconductor chip coupled thereto. A lid is placed on the circuit board. The lid includes an opening and an internal cavity. A liquid thermal interface material is placed in the internal cavity for thermal contact with the first semiconductor chip and the circuit board.
1. A method of manufacturing, comprising:
providing a semiconductor chip device including a circuit board and a first semiconductor chip coupled thereto;
placing a lid on the circuit board, the lid including an opening and an internal cavity in which the first semiconductor chip is positioned; and
placing a liquid thermal interface material in the internal cavity to encompass the first semiconductor chip and to establish thermal contact with the first semiconductor chip and the circuit board, the liquid thermal interface material being operable to be in a liquid state during operation of the first semiconductor chip.
2. The method of claim 1 , comprising placing the liquid thermal interface material in the internal cavity through the opening.
3. The method of claim 1 , comprising placing the circuit board on a support member operable to maintain the circuit board substantially level during placement of the liquid thermal interface material.
4. The method of claim 1 , comprising placing a heat spreader on the lid.
5. The method of claim 4 , wherein the heat spreader closes off the opening.
6. The method of claim 4 , wherein the heat spreader comprises a heat exchanger.
7. The method of claim 1 , wherein the semiconductor chip device comprises a second semiconductor chip.
8. The method of claim 7 , wherein the second semiconductor chip is stacked on the first semiconductor chip.
9. A method of manufacturing, comprising:
providing a semiconductor chip package including a package substrate and a first semiconductor chip coupled thereto;
placing a lid on the package substrate, the lid including an opening and an internal cavity in which the first semiconductor chip is positioned; and
placing a liquid thermal interface material in the internal cavity to encompass the first semiconductor chip and to establish thermal contact with the first semiconductor chip and the circuit board, the liquid thermal interface material being operable to be in a liquid state during operation of the first semiconductor chip.
10. The method of claim 9 , comprising placing the liquid thermal interface material in the internal cavity through the opening.
11. The method of claim 9 , comprising placing the circuit board on a support member operable to maintain the circuit board substantially level during placement of the liquid thermal interface material.
12. The method of claim 9 , comprising placing a heat spreader on the lid.
13. The method of claim 12 , wherein the heat spreader closes off the opening.
14. The method of claim 12 , wherein the heat spreader comprises a heat exchanger.
15. The method of claim 9 , wherein the semiconductor chip device comprises a second semiconductor chip.
16. The method of claim 15 , wherein the second semiconductor chip is stacked on the first semiconductor chip.
17. An apparatus, comprising:
a circuit board;
a first semiconductor chip coupled to the circuit board;
a lid coupled to the circuit board, the lid including an opening and an internal cavity in which the first semiconductor chip is positioned; and
a liquid thermal interface material in the internal cavity encompassing the first semiconductor chip and in thermal contact with the first semiconductor chip and the circuit board, the liquid thermal interface material being operable to be in a liquid state during operation of the first semiconductor chip.
18. The apparatus of claim 17 , wherein the lid comprises an opening to enable the liquid thermal interface material to enter the internal cavity.
19. The apparatus of claim 17 , comprising a support member operable to support and maintain the circuit board substantially level during placement of the liquid thermal interface material.
20. The apparatus of claim 17 , comprising a heat spreader on the lid.
21. The apparatus of claim 20 , wherein the heat spreader comprises a heat exchanger.
22. The apparatus of claim 17 , wherein the apparatus comprises a second semiconductor chip coupled to the circuit board.
23. The apparatus of claim 22 , wherein the second semiconductor chip is stacked on the first semiconductor chip.