Eutectic flow containment in a semiconductor fabrication process
View Patent ↗A disclosed semiconductor fabrication process includes forming a first bonding structure on a first surface of a cap wafer, forming a second bonding structure on a first surface of a device wafer, and forming a device structure on the device wafer. One or more eutectic flow containment structures are formed on the cap wafer, the device wafer, or both. The flow containment structures may include flow containment micro-cavities (FCMCs) and flow containment micro-levee (FCMLs). The FCMLs may be elongated ridges overlying the first surface of the device wafer and extending substantially parallel to the bonding structure. The FCMLs may include interior FCMLs lying within a perimeter of the bonding structure, exterior FCMLs lying outside of the bonding structure perimeter, or both. When the two wafers are bonded, the FCMLs and FCMCs confine flow of the eutectic material to the region of the bonding structure.
1. A micro-electro-mechanical device, comprising:
a device substrate including a device structure;
a cap substrate defining a device cavity overlying the device structure;
a bonding structure connecting the device substrate and the cap substrate, wherein the bonding structure circumvents the device structure;
a flow containment micro-levee (FCML) formed on a first substrate, wherein the first substrate is selected from the device substrate and the cap substrate, wherein the FCML comprises an elongated ridge overlying a first surface of the first substrate, the FCML extending substantially parallel to the bonding structure; and
a flow containment micro-cavity (FCMC) formed in a second substrate, wherein the second substrate is selected from the device substrate and the cap substrate, wherein the FCMC comprises an elongated channel formed in a first surface of the second substrate, the FCMC extending substantially parallel to the bonding structure;
wherein the FCML circumvents the bonding structure.
2. The device of claim 1 , wherein the FCML is circumvented by the bonding structure.
3. The device of claim 1 , wherein the FCML comprises a first FCML of a plurality of FCMLs.
4. The device of claim 1 , wherein the FCMC comprises a first FCMC of a plurality of FCMCs.
5. The device of claim 4 , wherein the plurality of FCMCs includes the first FCMC and a second FCMC, wherein the bonding structure circumvents the first FCMC and wherein the second FCMC circumvents the bonding structure.
6. The device of claim 1 , wherein the FCMC comprises a first FCMC of a plurality of FCMCs and wherein the FCML comprises a first FCML of a plurality of FCMLs.
7. The device of claim 6 , wherein the bonding structure circumvents the first FCML and the first FCMC and wherein a second FCML and a second FCMC circumvents the bonding structure.
8. The device of claim 7 , wherein a lateral displacement between the first FCML and the bonding structure is less than a lateral displacement between the first FCMC and the bonding structure.
9. The device of claim 8 , wherein a lateral displacement between the second FCML and the bonding structure is less than a lateral displacement between the second FCMC and the bonding structure.
10. The device of claim 8 , wherein a lateral displacement between the second FCML and the bonding structure is greater than a lateral displacement between the second FCMC and the bonding structure.
11. The device of claim 1 , wherein the first substrate and the second substrate are the same substrate.
12. The device of claim 11 , wherein the first substrate and the second substrate are the cap substrate.
13. The device of claim 1 , wherein the first substrate and the second substrate are different substrates.
14. The device of claim 13 , wherein the first substrate is the device substrate and the second substrate is the cap substrate.
15. A micro-electro-mechanical device, comprising:
a device substrate including a device structure;
a cap substrate defining a device cavity overlying the device structure;
a bonding structure connecting the device substrate and the cap substrate, wherein the bonding structure circumvents the device structure;
a flow containment micro-levee (FCML) formed on a first substrate, wherein the first substrate is selected from the device substrate and the cap substrate, wherein the FCML comprises an elongated ridge overlying a first surface of the first substrate, the FCML extending substantially parallel to the bonding structure; and
a flow containment micro-cavity (FCMC) formed in a second substrate, wherein the second substrate is selected from the device substrate and the cap substrate, wherein the FCMC comprises an elongated channel formed in a first surface of the second substrate, the FCMC extending substantially parallel to the bonding structure;
wherein the FCML has a height and the FCMC has a depth in a range of approximately 10% to approximately 70% of a height of the bonding structure, a lateral displacement between the bonding structure and the FCML is in a range of approximately 10 um to approximately 50 um, and a width of the FCML and the FCMC is in a range of approximately 10 um to approximately 50 um.
16. A micro-electro-mechanical device, comprising:
a device substrate including a device structure;
a cap substrate defining a device cavity overlying the device structure;
a bonding structure connecting the device substrate and the cap substrate, wherein the bonding structure circumvents the device structure;
a flow containment micro-levee (FCML) formed on a first substrate, wherein the first substrate is selected from the device substrate and the cap substrate, wherein the FCML comprises an elongated ridge overlying a first surface of the first substrate, the FCML extending substantially parallel to the bonding structure; and
a flow containment micro-cavity (FCMC) formed in a second substrate, wherein the second substrate is selected from the device substrate and the cap substrate, wherein the FCMC comprises an elongated channel formed in a first surface of the second substrate, the FCMC extending substantially parallel to the bonding structure;
wherein the FCML comprises a first FCML of a plurality of FCMLs and wherein the plurality of FCMLs includes the first FCML and a second FCML, wherein the bonding structure circumvents the first FCML and wherein the second FCML circumvents the bonding structure.