IP Library Granted Patent US 8,488,128
Granted Patent B2
US 8,488,128 · App. 12/919,488 · Granted Jul 16, 2013

Line edge roughness measuring technique and test structure

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Quick Facts
Patent No.
US 8,488,128
App. No.
12/919,488
Granted
Jul 16, 2013
Kind
B2
Abstract

A test structure is presented test structure on a substrate for monitoring a LER and/or LWR effect, said test structure comprising an array of features manufactured with amplified LER and/or LWR effect.

Claims (14)

1. A test structure on a substrate for monitoring a LER (Line Edge Roughness) and/or LWR effect (Line Width Roughness) during processing of said substrate, wherein said test structure comprises an array of features manufactured using artificial conditions providing amplified LER and/or LWR effect.

2. A test structure as in claim 1 , wherein said amplified LER and or LWR effect applied substantially along single axis of said array.

3. A test structure as in claim 1 , wherein said array of features being 2-D array.

4. A test structure as in claim 3 , wherein said amplified LER and/or LWR effect applied substantially along two mutually perpendicular axis of said array.

5. A test structure as in claim 1 , wherein said amplified LER and/or LWR effect caused by exposing using a mask having sub-resolution mask features.

6. A test structure as in claim 5 , wherein said sub-resolution mask features forming a 1-D array.

7. A test structure as in claim 5 , wherein said sub-resolution mask features forming a 2-D array.

8. A test structure as in claim 1 , being useful for an optical measurement.

9. A test structure as in claim 8 , being useful for a scatterometric measurement.

10. A test structure as in claim 8 , being useful for a spectral scatterometric measurement.

11. A test structure as in claim 1 further comprising an additional array of features characterized by substantially the same CD as the features manufactured with amplified LER and/or LWR effect.

12. An article comprising at least one test structure for monitoring a LER (Line Edge Roughness) and/or LWR effect (Line Width Roughness) during processing said substrate, wherein said test structure comprises an array of features manufactured using artificial conditions providing amplified LER and/or LWR effect.

13. An article as in claim 12 wherein said article is a semiconductor wafer.

14. An article as in claim 12 wherein said at least one test structure for monitoring a LER and/or LWR effect further comprising an additional array of features characterized by substantially the same CD as the features manufactured with amplified LER and/or LWR effect.

Assignments (2)
CHANGE OF NAME Recorded May 23, 2023
From: FROM NOVA MEASURING INSTRUMENTS LTD.
To: NOVA LTD.
Reel/Frame 063724/0340 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 20, 2013
From: BRILL, BOAZ
To: NOVA MEASURING INSTRUMENTS LTD
Reel/Frame 030487/0205 →