Devices and methods for thermally-mediated chemical reactions
One aspect of the invention provides container for thermal cycling a plurality of samples in a microfluidic array. The container includes a plurality of walls defining an interior volume and a conductive member for heating the interior volume. Another aspect of the invention provides container for thermal cycling a plurality of samples in a microfluidic array. The container includes a plurality of walls defining an interior volume and a plurality of conductive members for heating an interior volume. Another aspect of the invention provides a container for thermal cycling a plurality of samples in a microfluidic array. The container includes a plurality of walls defining an interior volume and a first conductive member located in the interior volume and adapted to contact a first end of the microfluidic array.
1. A through-hole array comprising:
a platen comprising:
a first external planar surface having a two-dimensional array of first openings;
a second external planar surface opposite the first planar surface, the second external planar surface having a two-dimensional array of second openings; and
a plurality of through-holes extending between the surfaces from each of the first openings to a corresponding one of the second openings;
a plurality of strips, the plurality of through-holes located on one or more of the plurality of strips; and
a plurality of electrically conductive fingers in contact with corresponding ones of the plurality of strips, the electrically conductive fingers configured to direct electrical current through the strips.
2. The through-hole array of claim 1 , wherein the strips are substantially parallel.
3. The through-hole array of claim 1 , further comprising:
one or more slots, each slot separating two of the plurality of strips.
4. The through-hole array of claim 1 , wherein the platen is formed from a conductive material.
5. The through-hole array of claim 4 , wherein the conductive material selected from the group consisting of: copper, gold, silver, nickel, iron, titanium, steel, and stainless steel.
6. The through-hole array of claim 1 , wherein the plurality of through-holes located on one of the plurality of strips are arranged in a single column.
7. The through-hole array of claim 1 , wherein the through-holes have a hydrophilic interior.
8. The through-hole array of claim 1 , further comprising:
two outer layers of hydrophobic material coupled to a top and a bottom surface of the plurality of the strips.
9. The through-hole array of claim 1 , wherein each of the plurality of through-holes has a volume less than 100 nanoliters.
10. A through-hole array comprising:
a platen comprising:
a first external planar surface having a two-dimensional array of first openings arranged in rows of openings disposed along a line;
a second external planar surface opposite the first planar surface, the second external planar surface having a two-dimensional array of second openings; and
a plurality of through-holes extending from each of the first openings to a corresponding one of the second openings; and
a plurality of pairs of electrically conductive fingers, each pair of fingers disposed at opposite ends per row, said fingers providing electrical current through a single row in the array.
11. The through-hole array of claim 10 , wherein the platen is formed from a conductive material.
12. The through-hole array of claim 11 , wherein the conductive material selected from the group consisting of: copper, gold, silver, nickel, iron, titanium, steel, and stainless steel.
13. The through-hole array of claim 10 , wherein the through-holes have a hydrophilic interior.
14. The through-hole array of claim 10 , wherein each of the plurality of through-holes has a volume less than 100 nanoliters.