IP Library Patent Application 12921677
Patent Application
App. No. 12/921,677

POLYPHENOLIC COMPOUNDS AND EPOXY RESINS COMPRISING CYCLOALIPHATIC MOIETIES AND PROCESS FOR THE PRODUCTION THEREOF

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Patent No.
US None
App. No.
12/921,677
Abstract

Epoxy resins and mixtures of polyphenolic compounds which comprise cycloaliphatic moieties, processes for the production thereof and mixtures and cured products which comprise these resins and/or mixtures.

Claims (43)

1 . A process for preparing a mixture of polyphenolic compounds, wherein the process comprises condensing a dialdehyde of a cycloalkane having from about 5 to about 24 ring carbon atoms with a phenolic compound at a ratio of phenolic hydroxy groups to aldehyde groups which affords a mixture of polyphenolic compounds which comprises at least about 20% by weight of a polyphenolic compound of formula (I):

wherein:

p is 0 or an integer of from 1 to about 19;

each m independently is 0, 1, or 2;

the moieties R independently represent halogen, cyano, nitro, hydroxy, optionally substituted alkyl, optionally substituted cycloalkyl, optionally substituted alkoxy, optionally substituted alkenyl, optionally substituted alkenyloxy, optionally substituted aryl, optionally substituted aralkyl, optionally substituted aryloxy, and optionally substituted aralkyloxy; and

the moieties Q represent hydrogen;

and any non-aromatic cyclic moieties comprised in the above formula (I) may optionally carry one or more substituents and/or may optionally comprise one or more double bonds.

2 . The process of claim 1 , wherein the mixture of polyphenolic compounds comprises at least about 50% by weight of the polyphenolic compound of formula (I).

3 . The process of claim 1 , wherein a molar ratio of phenolic compound to cycloalkane dialdehyde is at least about 5:1.

4 . The process of claim 1 , wherein the cycloalkane has from 6 to about 19 ring carbon atoms.

5 . The process of claim 1 , wherein the cycloalkane has 6, 7, or 8 ring carbon atoms.

6 . The process of claim 1 , wherein the dialdehyde comprises a cyclohexane dicarboxaldehyde.

7 . The process of claim 1 , wherein the phenolic compound comprises phenol.

8 . A mixture of polyphenolic compounds which is obtainable by the process of claim 1 .

9 . A process for preparing an epoxy resin, wherein the process comprises partially or completely converting phenolic hydroxy groups of the mixture of polyphenolic compounds of claim 8 into glycidyl ether groups.

10 . The process of claim 9 , wherein the process comprises contacting the mixture of polyphenolic compounds with epichlorohydrin.

11 . The process of claim 9 , wherein substantially all of the phenolic hydroxy groups are converted into glycidyl ether groups.

12 . An epoxy resin which is obtainable by the process of claim 9 .

13 . A mixture which comprises (i) the mixture of polyphenolic compounds of claim 8 and/or a prepolymerized form thereof and (ii) at least one compound and/or prepolymer thereof which is capable of reacting with (i).

14 . A mixture which comprises (i) the epoxy resin of claim 12 and/or a prepolymerized form thereof and (ii) at least one compound and/or prepolymer thereof which is capable of reacting with (i).

15 . A mixture which comprises (i) at least one of (a) the mixture of polyphenolic compounds of claim 8 and/or a prepolymerized form thereof and (b) an epoxy resin obtained by partially or completely converting phenolic hydroxy groups of the mixture of polyphenolic compounds into glycidyl ether groups and/or a prepolymerized form thereof and (ii) at least one of (c) a novolac resin and (d) an epoxy resin which is different from (b).

16 . The mixture of claim 15 , wherein the epoxy resin (d) comprises an epoxidized novolac resin.

17 . The mixture of claim 15 , wherein the mixture comprises a brominated epoxy resin.

18 . The mixture of claim 13 , wherein the mixture further comprises one or more substances which are selected from polymerization catalysts, co-curing agents, flame retardants, synergists for flame retardants, solvents, fillers, glass fibers, adhesion promoters, wetting aids, dispersing aids, surface modifiers, thermoplastic polymers, and mold release agents.

19 . The mixture of claim 13 , wherein the mixture is partially or completely cured.

20 . A product which comprises the mixture of claim 13 .

21 . The product of claim 20 , wherein the product is at least one of an electrical laminate, an IC substrate, a casting, a coating, a die attach and mold compound formulation, a composite, a potting composition, and an adhesive.

22 . A method of increasing at least one of the thermal resistance and the toughness of a material made from a novolac resin and/or an epoxidized novolac resin, wherein the method comprises replacing at least a part of the novolac resin and/or the epoxidized novolac resin by at least one of (a) the mixture of polyphenolic compounds of claim 8 and/or a prepolymerized form thereof and (b) an epoxy resin obtained by partially or completely converting phenolic hydroxy groups of the mixture of polyphenolic compounds into glycidyl ether groups and/or a prepolymerized form thereof.

23 . A polyfunctional compound of formula (I):

wherein:

p is 0 or an integer of from 1 to about 19;

each m independently is 0, 1, or 2;

the moieties R independently represent halogen, cyano, nitro, hydroxy, optionally substituted alkyl, optionally substituted cycloalkyl, optionally substituted alkoxy, optionally substituted alkenyl, optionally substituted alkenyloxy, optionally substituted aryl, optionally substituted aralkyl, optionally substituted aryloxy, and optionally substituted aralkyloxy; and

the moieties Q independently represent hydrogen and glycidyl;

and any non-aromatic cyclic moieties comprised in the above formula (I) may optionally carry one or more substituents and/or may optionally comprise one or more double bonds.

24 . The polyfunctional compound of claim 23 , wherein the moieties Q are identical.

25 . The polyfunctional compound of claim 23 , wherein all moieties Q represent hydrogen.

26 . The polyfunctional compound of claim 23 , wherein substantially all moieties Q represent glycidyl.

27 . The polyfunctional compound of claim 23 , wherein p has a value of from 1 to about 14.

28 . The polyfunctional compound of claim 23 , wherein p has a value of 1, 2, or 3.

29 . The polyfunctional compound of claim 23 , wherein p equals 1.

30 . The polyfunctional compound of claim 23 , wherein each m independently is 0 or 1.

31 . The polyfunctional compound of claim 23 , chosen from dimethylcyclohexane tetraphenol, and dimethylcyclohexane tetraphenol tetraglycidyl ether.

Assignments (3)
CHANGE OF NAME Recorded Mar 7, 2011
From: DOW GLOBAL TECHNOLOGIES INC.
To: DOW GLOBAL TECHNOLOGIES LLC
Reel/Frame 025912/0037 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2010
From: VARGAS, FABIO AGUIRRE; JACOB, GEORGE
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 025050/0321 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2010
From: HEARN, ROBERT L.; DETTLOFF, MARVIN L.
To: DOW GLOBAL TECHNOLOGIES INC.
Reel/Frame 025050/0473 →