Prepregs

1. A modified prepreg wherein regions of cured ink are located on uncured thermosetting resin that forms the uncured surface of a prepreg in order to reduce the porosity of laminates made from said prepreg, said prepreg comprising:

a prepreg comprising a layer of fibers and an uncured matrix, said uncured matrix comprising uncured thermosetting resin wherein said prepreg comprises an outer uncured fibre-free surface that is formed by said uncured thermosetting resin; and

a plurality of hardened fibre-free raised regions of cured ink that are located on top of said outer uncured fibre-free surface, said regions of cured ink having a thickness that extends a height above said outer uncured fibre-free surface wherein the thickness of said regions of cured ink is from 10 to 100 micrometers.

2. A modified prepreg according to claim 1 , wherein said regions of cured ink are formed by exposing a liquid curable ink to ultra-violet or visible light.

3. A modified prepreg according to claim 1 , wherein the fibres in the prepreg are urn-directional and the regions of cured ink are in the form of segmented parallel lines that run parallel to the fibres.

4. A modified prepreg according claim 1 wherein the regions of cured ink, have a thickness of from 10 to 36 micrometers.

5. A modified prepreg according to claim 1 wherein the regions of cured ink are non-conducting.

6. A method of curing, a laminate of a plurality of modified prepregs according to claim 1 , the method comprising exposing the laminate to elevated temperature to cure said uncured thermosetting resin to produce a cured composite laminate.

7. A cured laminate of a plurality of modified prepregs obtainable by the method according to claim 6 .

8. A modified prepreg according to claim 1 wherein said uncured thermosetting resin is an uncured epoxy resin.

9. A modified prepreg according to claim 8 wherein said regions of cured ink are made from liquid curable ink that comprises acrylic or vinyl ether.

10. A modified prepreg according to claim 1 wherein said regions of cured ink are in the form of a pattern of parallel lines wherein each line has a thickness that extends a line height above said outer uncured fibre-free surface.

11. A modified prepreg according to claim 10 wherein said regions of cured ink are in the form of a pattern of parallel lines, said parallel lines being broken into segments to form broken parallel lines.

12. A modified prepreg according to claim 10 wherein the average line height of said regions of cured ink is 12 microns.

13. A modified prepreg according to claim 10 wherein the average line height of said regions of cured ink is 26 microns.

14. A modified prepreg according to claim 10 wherein the average line height of said regions of cured ink is 36 microns.

15. A modified prepreg according to claim 11 wherein the average line height of said regions of cured ink is 12 microns.

16. A modified prepreg according to claim 11 wherein the average line height of said regions of cured ink is 26 microns.

17. A modified prepreg according to claim 11 wherein the average line height of said regions of cured ink is 36 microns.

18. A modified prepreg according to claim 12 wherein said uncured thermosetting resin is an uncured epoxy resin and wherein said regions of cured ink are made from liquid curable ink that comprises acrylic or vinyl ether.

19. A modified prepreg according to claim 13 wherein said uncured thermosetting resin is an uncured epoxy resin and wherein said regions of cured ink are made from liquid curable-ink that comprises acrylic or vinyl ether.

20. A modified prepreg according to claim 14 wherein said uncured thermosetting resin is an uncured epoxy resin and wherein said regions of cured ink are made from liquid curable ink that comprises acrylic or vinyl ether.