Semiconductor circuit device and data processing system
Occurrence of power supply noise arising in connection with a step-down action at the time of turning on power supply is to be restrained. A step-down unit is provided with a switched capacitor type step-down circuit and a series regulator type step-down circuit, and stepped-down voltage output terminals of the step-down circuits are connected in common. The common connection of the stepped-down voltage output terminals of both step-down circuits makes possible parallel driving of both, selective driving of either or consecutive driving of the two. In the consecutive driving, even if the switched capacitor type step-down circuit is driven after driving the series regulator type step-down circuit first to supply a stepped-down voltage to loads, the switched capacitor type step-down circuit will need only to be compensated for a discharge due to the loads, and a peak of a charge current for capacitors can be kept low. When operation of the switched capacitor type step-down circuit is started, no large rush current arises, and occurrence of noise is restrained.
1. A semiconductor circuit device having a step-down unit formed over a semiconductor chip and configured to generate a stepped down voltage from a first external source voltage and a second reference voltage,
wherein the semiconductor chip has a plurality of pairs of PADS each including a first PAD connected to the first external source voltage and a second PAD connected to the second reference voltage, and the step-down unit includes a switched capacitor step-down circuit and the switched capacitor step-down circuit includes a plurality of switch arrays, each switch array being arranged to be near to one of the pairs of PADs.
2. The semiconductor circuit device according to claim 1 , further including a series regulator type step-down circuit and a step-down control circuit, and wherein a stepped-down voltage output terminal of the switched capacitor step-down circuit and a stepped-down voltage output terminal of the series regulator type step-down circuit are connected in common.
3. The semiconductor circuit device according to claim 2 , further including a plurality of third PADs that are connected to a switching capacitance, the third PADs being arranged to be near to the switch arrays.
4. The semiconductor circuit device according to claim 3 , wherein the third PADs are connected to a smoothing capacitance that is sealed into a package together with the semiconductor chip.
5. The semiconductor circuit device according to claim 4 , wherein the semiconductor chip and the smoothing capacitance are arranged adjacent to each other, and wherein each of the third PADs and the smoothing capacitance are connected by a bonding wire.
6. The semiconductor circuit device according to claim 4 , wherein the smoothing capacitance is mounted on the semiconductor chip.
7. The semiconductor circuit device according to claim 4 , wherein the smoothing capacitance is mounted on lead terminals of the package.