Electrochemical device
Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10 - 1 includes a package 14 that is constructed with a film or films and has sealed parts 14 a 1 to 14 a 3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14 a 1 to 14 a 3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.
1. An electrochemical device adapted to be mounted by soldering, wherein the electrochemical device comprises:
a package that is constructed with a film or films and has a sealed portion formed by sealing edge portions of the film(s) superimposed on each other;
an electric storage element that is enclosed in the package; and
a support that has higher rigidity than the film(s) and covers and contacts entirely and liquid-tightly at least the sealed portion of the package including portions from which electrode terminals are led out, wherein the support covers solely the sealed portion of the package.
2. The electrochemical device according to claim 1 , wherein the contour of the package is rectangular, and the sealed portion of the package is formed at least on three sides of the rectangular package.
3. The electrochemical device according to claim 1 , wherein an interior inside the package enclosing the electric storage element is filled with an electrolyte.
4. The electrochemical device according to claim 1 , wherein the film(s) is/are constituted by a laminated film comprising an outer protective layer, a barrier layer, an insulating layer, and an inner sealing layer.
5. The electrochemical device according to claim 1 , further comprising a positive-electrode terminal and a negative-electrode terminal led out from the electric storage element and jutting out from the support through the sealed portion of the package.
6. The electrochemical device according to claim 1 , wherein the support is made of a material having higher rigidity than a material of the film(s), said material being selected from the group consisting of a ceramic including alumina, a surface-insulated metal including an alloy or cold-rolled aluminum, and a plastic including an epoxy resin, an aramid resin, or a polyimide resin.