IP Library Granted Patent US 8,460,501
Granted Patent B2
US 8,460,501 · App. 12/937,939 · Granted Jun 11, 2013

Cured film and method for production thereof

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,460,501
App. No.
12/937,939
Granted
Jun 11, 2013
Kind
B2
Abstract

This invention relates to a method for producing a cured film, which comprises a first step of applying a curable resin composition onto a surface of a first substrate and a surface of a second substrate respectively; a second step of bonding the curable resin composition layers provided on each surface of the first and second substrates to each other; and a third step of curing the curable resin composition layer between the first and the second substrates. The present invention enables production of a cured film in which the amount of thermal deformation such as warpage upon heating/cooling is suppressed, and the film can be suitably used as a plastic substrate for a display such as a liquid crystal display device and an organic EL display device, a substrate for a display, such as a substrate for electronic paper and the like, and a substrate for a solar cell.

Claims (9)

1. A method for producing a cured film comprising a first step of applying a curable resin composition onto a surface of a first substrate and onto a surface of a second substrate to form first and second curable resin composition layers, respectively; a second step of bonding the first and second curable resin composition layers provided on each surface of the first and second substrates to each other to form a bonded curable resin composition layer; a third step of curing the bonded curable resin composition layer between the first and the second substrates; and a fourth step of removing the first and second substrates of the bonded curable resin composition from the cured layer, thereby forming a free-standing cured layer.

2. The method for producing a cured film as claimed in claim 1 , wherein the curable resin composition contains a volatile solvent and/or a reactive monomer.

3. The method for producing a cured film as claimed in claim 1 , comprising a step of drying the curable resin composition layer between the first and second steps.

4. The method for producing a cured film as claimed in claim 1 , wherein the curable resin composition contains at least one member selected from a group consisting of allyl ester resin, (meth)acrylic resin and vinyl ester resin.

5. The method for producing a cured film as claimed in claim 1 , wherein the curable resin composition contains a layered inorganic compound.

6. The method for producing a cured film as claimed in claim 5 , wherein the layered inorganic compound is a synthetic smectite.

7. The method for producing a cured film as claimed in claim 1 , wherein the curing is conducted by at least one of an electron beam (EB) irradiation, an ultraviolet ray (UV) irradiation, an infrared ray (IR) irradiation and heating.

8. The method for producing a cured film as claimed in claim 7 , wherein the curable resin composition layer between the first and second substrates is cured by being irradiated by electron beam (EB), ultraviolet ray (UV) or infrared ray (IR) with almost the same exposure from the side of the first substrate and that of the second substrate.

9. The method for producing a cured film as claimed in claim 7 , wherein the curing by heating is conducted by applying almost the same amount of heat to the curable resin composition layer between the first and second substrates from the side of the first substrate and that of the second substrate.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2010
From: KADOWAKI, YASUSHI; TOITA, RYOJI; SHIMAMURA, KENJI
To: SHOWA DENKO K.K.
Reel/Frame 025154/0319 →