CIRCUIT BOARD
A circuit board including a circuit layer, a thermally conductive substrate, an insulation layer, and at least one thermally conductive material is provided. The thermally conductive substrate has a plane. The insulation layer is disposed between the circuit layer and the plane and partially covers the plane. The thermally conductive material covers the plane without covered by the insulation layer and is in contact with the thermally conductive substrate. The insulation layer exposes the thermally conductive material.
1 . A circuit board, comprising:
a circuit layer;
a thermally conductive substrate, having a plane;
an insulation layer, disposed between the circuit layer and the plane, wherein the insulation layer partially covers the plane; and
at least one thermally conductive material, covering the plane without covered by the insulation layer, and in contact with the thermally conductive substrate, wherein the insulation layer exposes the thermally conductive material.
2 . The circuit board according to claim 1 , wherein the thermally conductive substrate comprises a thermally conductive layer and a main body layer, and the thermally conductive layer is located between the main body layer and the insulation layer.
3 . The circuit board according to claim 2 , wherein the thermally conductive layer is a metal layer or a carbon-material layer.
4 . The circuit board according to claim 1 , wherein the thermally conductive substrate is a metal plate or a carbon-material plate.
5 . The circuit board according to claim 1 , wherein the thermally conductive material is a ceramic layer, a thermal pad, or a thermal glue layer.
6 . The circuit board according to claim 1 , further comprising at least one electronic component, wherein the electronic component comprises:
a component main body, having a bottom surface; and
a plurality of pads, disposed on the bottom surface and electrically connected to the circuit layer, wherein at least one pad is thermally coupled to the thermally conductive material.
7 . The circuit board according to claim 6 , further comprising a plurality of solder bumps connecting to the electronic component and the thermally conductive substrate, wherein each of the solder bumps is connected to one of the pads, and the solder bumps are in contact with the pads and the circuit layer.
8 . The circuit board according to claim 6 , wherein an area of the bottom surface is smaller than an area of the plane covered by the thermally conductive material.
9 . The circuit board according to claim 8 , wherein the thermally conductive material has a contact surface in contact with the thermally conductive substrate and a side edge connecting to the contact surface, and the component main body does not protrude from the side edge.
10 . The circuit board according to claim 6 , wherein an area of the bottom surface is larger than an area of the plane covered by the thermally conductive material.
11 . The circuit board according to claim 10 , wherein the component main body further has a side surface connecting to the bottom surface, and the thermally conductive material does not protrude from the side surface.