IP Library Granted Patent US 8,511,170
Granted Patent B2
US 8,511,170 · App. 12/949,356 · Granted Aug 20, 2013

Pressure transducer having structure for monitoring surface charge

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Quick Facts
Patent No.
US 8,511,170
App. No.
12/949,356
Granted
Aug 20, 2013
Kind
B2
Abstract

A pressure transducer includes a substrate, a piezoresistive element, a first conductive element, a first terminal, and a test structure. The substrate has a surface and a cavity. A diaphragm layer is formed over the cavity and over the surface of the substrate. The piezoresistive element is formed in the diaphragm layer. The first conductive element is formed in the diaphragm layer, and has a first conductivity type. The first conductive element is coupled to the piezoresistive element. The first terminal is formed over a surface of the diaphragm layer and coupled to the first conductive element. The test structure has the first conductivity type and is formed in the diaphragm layer. The test structure has an edge spaced apart from an edge of the first conductive element by a predetermined distance. A surface charge accumulation on the diaphragm layer is detected using the test structure.

Claims (41)

1. A pressure transducer comprising:

a substrate having a surface and a cavity, a diaphragm layer formed over the cavity and over the surface of the substrate;

a piezoresistive element formed in the diaphragm layer;

a first conductive element formed in the diaphragm layer, the first conductive element having a first conductivity type, and the first conductive element coupled to the piezoresistive element;

a first terminal formed over the surface of the diaphragm layer and coupled to the first conductive element; and

a test structure having the first conductivity type and formed in the diaphragm layer, the test structure having an edge spaced apart from an edge of the first conductive element by a predetermined distance, wherein a surface charge accumulation over a surface of the diaphragm layer is detected using the test structure.

2. The pressure transducer of claim 1 , wherein the first conductivity type is a P+ conductivity type.

3. The pressure transducer of claim 1 , further comprising a second terminal coupled to the test structure, wherein a change in resistance between the first terminal and the second terminal is used to indicate the surface charge accumulation.

4. The pressure transducer of claim 1 , further comprising:

a plurality of piezoresistive elements formed in the diaphragm layer; and

a plurality of conductive elements for electrically connecting the plurality of piezoresistive elements in a resistive bridge configuration.

5. The pressure transducer of claim 4 , wherein the plurality of piezoresistive elements comprises a plurality of pairs of piezoresistive elements.

6. The pressure transducer of claim 1 , wherein the substrate and the diaphragm layer comprise silicon.

7. The pressure transducer of claim 1 , wherein the piezoresistive element has a P-conductivity type.

8. The pressure transducer of claim 1 , further comprising a second terminal coupled to the test structure.

9. The pressure transducer of claim 1 , wherein the test structure and the first conductive element form a charge test transistor in the diaphragm layer, and wherein the accumulation of surface charge on the surface of the diaphragm layer forms a channel region between the test structure and the conductive element.

10. A pressure transducer comprising:

a substrate having a surface and a cavity;

an oxide layer formed on the surface of the substrate;

a diaphragm layer formed over the cavity and over the oxide layer;

a plurality of piezoresistive elements implanted in the diaphragm layer;

a plurality of conductive elements implanted in the diaphragm layer, the plurality of conductive elements having a first conductivity type, and each of the plurality of conductive elements coupled to corresponding ones of the plurality of piezoresistive elements;

a test structure having the first conductivity type and formed in the diaphragm layer, the test structure having an edge spaced apart from an edge of a conductive element of the plurality of conductive elements by a predetermined distance, wherein a surface charge accumulation over a surface of the diaphragm layer is detected using the test structure.

11. The pressure transducer of claim 10 , wherein the first conductivity type is a P+ conductivity type.

12. The pressure transducer of claim 10 , wherein the plurality of piezoresistive elements comprise a plurality of pairs of piezoresistive elements.

13. The pressure transducer of claim 10 , wherein the plurality of piezoresistive elements are coupled together to form a resistance bridge using the plurality of conductive elements.

14. The pressure transducer of claim 10 , further comprising a test pad coupled to the test structure.

15. The pressure transducer of claim 10 , wherein the diaphragm layer has a second conductivity type different from the first conductivity type.

16. The pressure transducer of claim 10 , wherein the surface charge accumulation is measured by measuring one of a resistance, a current, or a voltage between the test structure and the conductive element of the plurality of conductive elements.

17. A pressure transducer comprising:

a substrate having a surface and a cavity;

an oxide layer formed on the surface of the substrate;

a diaphragm layer formed over the cavity and over the oxide layer, the diaphragm layer having a first conductivity type;

a plurality of piezoresistive elements implanted in the diaphragm layer;

a plurality of conductive elements implanted in the diaphragm layer, the plurality of conductive elements having a second conductivity type, and each of the plurality of conductive elements coupled to corresponding ones of the plurality of piezoresistive elements, wherein the plurality of piezoresistive elements are coupled together using the plurality of conductive elements to form a resistance bridge;

a test structure having the second conductivity type and formed in the diaphragm layer, the test structure having an edge spaced apart from an edge of a conductive element of the plurality of conductive elements by a predetermined distance, wherein a surface charge accumulation over a surface of the diaphragm layer is detected using the test structure;

a plurality of pads coupled to selected ones of the plurality of conductive elements; and

a test pad coupled to the test structure.

18. The pressure transducer of claim 17 , wherein the first conductivity type is N-type and the second conductivity type is P-type.

19. The pressure transducer of claim 17 , wherein the diaphragm layer comprises silicon.

20. The pressure transducer of claim 17 , the surface charge accumulation is measured by measuring one of a resistance, a current, or a voltage between the test structure and the conductive element of the plurality of conductive elements.

Assignments (17)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0241. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
MERGER Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0387 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0334 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0285 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →