METHOD AND APPARATUS FOR CHEMICAL DEPOSITION
Embodiments of the present system and method are useful for chemical deposition, particularly continuous deposition of thin films. Disclosed systems typically comprise a micromixer and a microchannel applicator. A deposition material or materials is applied to a substrate, such as an oxidized silicon substrate, a flexible substrate useful for forming flexible devices, such as flexible transistors, and combinations of different substrates. Uniform and highly oriented surface morphologies of films deposited using disclosed embodiments are clearly improved compared to films deposited by a conventional batch process. The process can be used to tailor the composition and morphology of the material deposited on a substrate. The present process can be used at low temperatures as a post-deposition, high-temperature annealing step is obviated.
1 - 10 . (canceled)
11 . An apparatus for chemical deposition, comprising:
a micromixer, fluidly coupled to a first fluid source and a second fluid source, for receiving and mixing first and second fluids comprising reactants to initiate formation of a deposition material;
a temperature controlled reaction time channel for receiving and controlling reaction time of the reactants;
a substrate support for positioning a substrate for receiving the deposition material;
a substrate heater having a temperature control unit operatively associated with the substrate; and
an applicator for receiving deposition material and applying the deposition material to a heated substrate.
12 . The apparatus according to claim 11 where the micromixer is an interdigital micromixer, a nozzle micromixer, or a microjet mixer.
13 . The apparatus according to claim 11 comprising a continuous production apparatus.
14 . The apparatus according to claim 11 further comprising at least one pump for pumping the first and/or second fluids to the micromixer.
15 . The apparatus according to claim 11 comprising plural micromixers.
16 . The apparatus according to claim 11 comprising at least a third fluid source operably coupled to the micromixer.
17 . The apparatus according to claim 11 where the first and second fluids are introduced to the micromixer as counter-flowing fluid streams.
18 . The apparatus according to claim 11 where the temperature controlled reaction time channel is immersed in a fluid bath to provide temperature control.
19 . The apparatus according to claim 18 where the fluid bath is a water bath.
20 . The apparatus according to claim 11 where length of the channel, temperature of reactants in the channel, material flow rate through the channel, and material residence time in the channel are selected to control homogeneous chemistry of the deposition material for application to the substrate.
21 . The apparatus according to claim 11 further comprising a continuous susceptor.
22 . The apparatus according to claim 21 where the continuous susceptor is a continuous roll-to-roll susceptor or a rotating disk substrate susceptor.
23 . The apparatus according to claim 11 where the applicator is a microchannel applicator.
24 . The apparatus according to claim 11 comprising a chip-based apparatus.