IP Library Granted Patent US 8,461,624
Granted Patent B2
US 8,461,624 · App. 12/952,023 · Granted Jun 11, 2013

Monolithic three terminal photodetector

Inventors: Yun-chung N Na (Palo Alto, CA); Yimin Kang (San Jose, CA)
Assignee: Intel Corporation
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Quick Facts
Patent No.
US 8,461,624
App. No.
12/952,023
Granted
Jun 11, 2013
Kind
B2
Abstract

Photodetectors operable to achieve multiplication of photogenerated carriers at ultralow voltages. Embodiments include a first p-i-n semiconductor junction combined with a second p-i-n semiconductor junction to form a monolithic photodetector having at least three terminals. The two p-i-n structures may share either the p-type region or the n-type region as a first terminal. Regions of the two p-i-n structures doped complementary to that of the shared terminal form second and third terminals so that the first and second p-i-n structures are operable in parallel. A multiplication region of the first p-i-n structure is to multiply charge carriers photogenerated within an absorption region of the second p-i-n structure with voltage drops between the shared first terminal and each of the second and third terminals being noncumulative.

Claims (39)

1. A monolithic three terminal photodetector, comprising:

first doped semiconductor regions of a first conductivity type coupled to a first terminal of the photodetector;

second doped semiconductor regions of a second conductivity type, complementary to the first type, interdigitated with the first regions over an area of a substrate with an intervening semiconductor region of lower impurity concentration than the first and second regions separating the first and second regions, the second semiconductor regions coupled to a second terminal of the photodetector; and

a semiconductor absorption region disposed proximate to the intervening semiconductor region and coupled to a third terminal of the photodetector, and to at least one of the first and second terminals.

2. The photodetector of claim 1 , wherein the first doped semiconductor regions are n-type and the second doped semiconductor regions are p-type.

3. The photodetector of claim 1 , wherein the intervening semiconductor region comprises a first group IV semiconductor and wherein the absorption region comprises a second group IV semiconductor.

4. The photodetector of claim 3 , wherein the first group IV semiconductor is one of Si, Ge, or a Si x Ge y alloy and wherein the second group IV semiconductor is another of Si, Ge, or Si x Ge y alloy.

5. The photodetector of claim 4 , wherein the first group IV semiconductor is Si and the second group IV semiconductor is Ge and wherein the absorption region is coupled to the third terminal through a p-type region.

6. The photodetector of claim 5 , wherein the absorption region has a thickness of between 0.4 μm and 3 μm.

7. The photodetector of claim 2 , wherein the multiplication region and absorption regions are intrinsically doped.

8. The photodetector of claim 2 , wherein the multiplication region has a width of between 30 nm and 150 nm.

9. The photodetector of claim 2 , further comprising a dopant diffusion barrier between the absorption region and the multiplication region.

10. The photodetector of claim 1 , wherein the area of the substrate is between 4 μm 2 and 20 μm 2 .

11. A photodetector circuit, comprising:

the photodetector of claim 1 ; and

one or more voltage supply coupled to the photodetector with the second and third terminals both coupled to a common node at a reference voltage.

12. The circuit of claim 11 , wherein the one or more voltage supply provides less than 6V.

13. The circuit of claim 12 , wherein a reverse bias across the first and second terminal is sufficient to induce carrier multiplication within an i-layer disposed between the first and second doped semiconductor regions, and wherein a reverse bias across the first and third terminal is sufficient to induce carrier drift within the semiconductor absorption region.

14. The circuit of claim 11 , wherein the semiconductor absorption region is optically coupled a waveguide.

15. The circuit of claim 11 , further comprising a p-type layer coupling the semiconductor absorption region to the third terminal.

16. A monolithic three terminal photodetector, comprising:

n-type semiconductor regions coupled to a first terminal;

p-type semiconductor regions interdigitated with the n-type regions over an area of a substrate, the p-type semiconductor regions coupled to a second terminal;

a semiconductor absorption region disposed proximate to the n-type and p-type regions and coupled to a third terminal and to at least one of the first and second terminals; and

an avalanche multiplication region between the first and second terminals, wherein the multiplication region and absorption regions are intrinsically doped.

17. A monolithic three terminal photodetector, comprising:

n-type semiconductor regions coupled to a first terminal;

p-type semiconductor regions interdigitated with the n-type regions over an area of a substrate, the p-type semiconductor regions coupled to a second terminal;

a semiconductor absorption region disposed proximate to the n-type and p-type regions and coupled to a third terminal and to at least one of the first and second terminals;

an avalanche multiplication region between the first and second terminals; and

a dopant diffusion barrier between the absorption region and the multiplication region.

18. A photodetector circuit, comprising:

a monolithic three terminal photodetector, comprising:

n-type semiconductor regions coupled to a first terminal;

p-type semiconductor regions interdigitated with the n-type regions over an area of a substrate, the p-type semiconductor regions coupled to a second terminal;

a semiconductor absorption region disposed proximate to the n-type and p-type regions and coupled to a third terminal and to at least one of the first and second terminals; and

an avalanche multiplication region between the first and second terminals; and

one or more voltage supply coupled to the photodetector with the second and third terminals both coupled to a common node at a reference voltage.

19. The circuit of claim 18 , wherein the one or more voltage supply is to provide less than 6V.

Assignments (2)
CONFIRMATORY LICENSE Recorded Feb 19, 2015
From: INTEL CORPORATION
To: DARPA
Reel/Frame 034988/0701 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2010
From: NA, YUN-CHUNG N; KANG, YIMIN
To: INTEL CORPORATION
Reel/Frame 025457/0078 →
Continuity (1)
Related Publication 20120126286A1 · May 24, 2012