Gallium nitride-based III-V group compound semiconductor device and method of manufacturing the same

1. A method of manufacturing a gallium nitride-based III-V group compound semiconductor device, the method comprising:

forming a gallium nitride-based semiconductor layer comprising P and N contact structures on a substrate; and

forming an ohmic electrode layer on the gallium nitride-based semiconductor layer by depositing a contact metal layer, reflective metal layer, a diffusion barrier layer, and a bonding metal layer,

wherein forming the ohmic electrode layer comprises sequentially depositing the contact metal layer, the reflective metal layer, and the diffusion barrier layer on the gallium nitride based-semiconductor layer,

wherein the reflective metal layer is deposited directly on the contact metal layer, and the diffusion barrier layer is deposited directly on the reflective metal layer, and

wherein the bonding metal layer comprises the same material as that of the contact metal layer.

2. The method of claim 1 , wherein forming the ohmic electrode layer further comprises:

performing a thermal treatment process.

3. The method of claim 1 , wherein forming the ohmic electrode layer further comprises:

performing a thermal treatment process,

wherein the contact metal layer, the reflective metal layer, the diffusion barrier layer, and the bonding metal layer are sequentially deposited on the semiconductor layer.

4. The method of claim 2 , wherein the thermal treatment process is an annealing process in an atmosphere ranging from 5% to 100% oxygen at a temperature ranging from 100° C. to 700° C. for 10 seconds to 100 seconds.

5. The method of claim 3 , wherein the thermal treatment process is an annealing process in an atmosphere ranging from 5% to 100% oxygen at a temperature ranging from 100° C. to 700° C. for 10 seconds to 100 seconds.

6. The method of claim 1 , wherein depositing the contact metal layer comprises depositing a first contact metal layer and depositing a second contact metal layer, and

wherein the first contact metal layer comprises one of Ni, Pt, Pd, Au, Ti, Ru, W, Ta, V, Co, Os, Re, and Rh, and the second contact metal layer comprises Ir.

7. The method of claim 6 , wherein depositing the contact metal layer further comprises depositing a third contact metal layer,

wherein the first contact metal layer comprises a Ni layer, and the third contact metal layer comprises a Pt layer, and

wherein depositing the bonding metal layer comprises depositing a first bonding metal layer and depositing a second bonding metal layer, the first bonding metal layer comprising at least one of Ni, Cr, Ti, Pd, Ru, Ir, Rh, Re, Os, V, and Ta, and the second bonding metal layer comprising at least one of Au, Pd, and Pt.

8. The method of claim 7 , wherein the contact metal layer has a thickness in the range of 5 to 500 Å, the reflective metal layer has a thickness in the range of 100 to 9,000 Å, the diffusion barrier layer has a thickness in the range of 50 to 1,000 Å, the first bonding metal layer has a thickness in the range of 100 to 3,000 Å, and the second bonding metal layer has a thickness in the range of 100 to 9,000 Å.

9. The method of claim 8 , wherein the thickness of the contact metal layer does not exceed 200 Å, the thickness of the reflective metal layer is in the range of 1,000 to 2,000 Å, the thickness of the diffusion barrier layer is in the range of 100 to 800 Å, the thickness of the first bonding metal layer does not exceed 1,000 Å, and the thickness of the second bonding metal layer does not exceed 1,000 Å.

10. The method of claim 1 , forming the ohmic electrode layer on the gallium nitride-based semiconductor layer comprises:

depositing the contact metal layer directly on the gallium nitride-based semiconductor layer;

depositing the reflective metal layer directly on the contact metal layer;

depositing the diffusion barrier layer directly on the reflective layer;

depositing a first bonding metal layer directly on the diffusion barrier layer; and

depositing a second bonding metal layer directly on the first bonding metal layer.