Methods and apparatus for using a configuration array similar to an associated data array

1. A method comprising:

disposing a data array in a first orientation on a substrate;

disposing a configuration array in the first orientation on the substrate, wherein the configuration array is associated with, but separate from, the data array; and

disposing a plurality of zia contact regions in the configuration array in substantially similar relative locations as a plurality of zia contact regions disposed in the data array.

2. The method of claim 1 , wherein the data array and the configuration array each includes a plurality of wordlines and a plurality of bitlines, wherein:

the plurality of wordlines in the data array extend in a first direction and the plurality of wordlines in the configuration array extend in the first direction;

the plurality of bitlines in the data array extend in a second direction and the plurality of bitlines in the configuration array extend in the second direction; and

wherein orienting a configuration array includes aligning the wordlines in the configuration array substantially parallel with the wordlines in the data array and aligning the bitlines in the configuration array substantially parallel with the bitlines in the data array.

3. The method of claim 1 , further comprising laying out a wordline driver for use with the configuration array that is substantially similar to a layout of a wordline driver used with the data array.

4. The method of claim 1 , further comprising laying out a bitline driver for use with the configuration array that is substantially similar to a layout of a bitline driver used with the data array.

5. The method of claim 1 , further comprising selecting a diode sensing orientation for the configuration array that is substantially similar to a diode sensing orientation of the data array.

6. The method of claim 1 , further comprising laying out a sense amplifier for use with the configuration array that is substantially similar to a layout of a sense amplifier used with the data array.

7. The method of claim 1 , further comprising laying out a voltage regulator for use with the configuration array that is substantially similar to a layout of a voltage regulator used with the data array.

8. The method of claim 1 , further comprising laying out a plurality of conductors proximate to the configuration array substantially similar to a layout of a plurality of conductors proximate to the data array.

9. A method comprising:

disposing a data array on a substrate;

disposing a configuration array on the substrate in an orientation substantially similar to an orientation of the data array, wherein the configuration array is associated with, but separate from, the data array and adapted to store configuration information for configuring the data array; and

disposing a plurality of zia contact regions in the configuration array in substantially similar relative locations as a plurality of zia contact regions disposed in the data array.

10. The method of claim 9 , wherein disposing a configuration array includes aligning wordlines of the configuration array substantially parallel with wordlines of the data array and aligning bitlines of the configuration array substantially parallel with bitlines of the data array.

11. The method of claim 9 , further comprising selecting elements of the configuration array to be substantially similar to corresponding elements of the data array wherein the elements include at least one of:

a substantially similar wordline driver layout;

a substantially similar bitline driver layout;

a substantially similar diode sensing orientation;

a substantially similar sense amplifier layout;

a substantially similar voltage regulator layout; and

a substantially similar layout of conductors proximate to the arrays.

12. The method of claim 9 , wherein disposing a data array on a substrate includes disposing a data array that includes support logic, and the configuration information is associated with operation of the support logic.

13. The method of claim 9 , wherein disposing a data array on a substrate includes disposing a data array that includes a plurality of non-volatile memory cells.

14. The method of claim 9 , wherein disposing a data array on a substrate includes disposing a data array that includes a plurality of two-terminal memory cells.

15. The method of claim 9 , wherein disposing a data array on a substrate includes disposing a data array that includes at least one of flash memory, NAND flash memory, electrically erasable programmable memory, ultraviolet erasable programmable memory, magnetic memory, one time programmable memory, ferroelectric RAM, and carbon nano-tube based memory.

16. The method of claim 9 , wherein the configuration information defines a logical structure of the data array.

17. The method of claim 9 , wherein the configuration information includes at least one of trimbit values, reference voltage values, and mode selection values.

18. The method of claim 9 , wherein disposing a configuration array on the substrate includes disposing a configuration array that includes a plurality of non-volatile memory cells.

19. The method of claim 9 , wherein disposing a configuration array on the substrate includes disposing a configuration array that includes a plurality of two-terminal memory cells.

20. The method of claim 9 , wherein disposing a configuration array on the substrate includes disposing a configuration array that includes at least one of fuse based memory and antifuse based memory.

21. The method of claim 9 , wherein disposing a data array on a substrate includes disposing a data array that includes a plurality of 3D memory cells, and wherein disposing a configuration array on the substrate includes disposing a configuration array that includes a plurality of 3D memory cells.