IP Library Granted Patent US 8,004,004
Granted Patent B2
US 8,004,004 · App. 12/955,620 · Granted Aug 23, 2011

Semiconductor light emitting element, method for manufacturing the same, and light emitting device

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Quick Facts
Patent No.
US 8,004,004
App. No.
12/955,620
Granted
Aug 23, 2011
Kind
B2
Abstract

The present invention provides a semiconductor light emitting element with excellent color rendering properties, a method for manufacturing the semiconductor light emitting element, and a light emitting device. The semiconductor light emitting element includes: a semiconductor substrate that has a convex portion having a tilted surface as an upper face, and a concave portion formed on either side of the convex portion, the concave portion having a smaller width than the convex portion, a bottom face of the concave portion being located in a deeper position than the upper face of the convex portion; and a light emitting layer that is made of a nitride-based semiconductor and is formed on the semiconductor substrate so as to cover at least the convex portion.

Claims (13)

1. A semiconductor light emitting element comprising:

a semiconductor substrate;

an n-type GaN layer that is provided on the semiconductor substrate;

a light emitting layer that is provided on the n-type GaN layer and has a multiquantum well structure having barrier layers and well layers alternately stacked; and

a contact layer that is provided on the light emitting layer and is made of p-type GaN,

a mean refractive index of the barrier layers and the well layers being lower than a mean refractive index of the layers existing on and under the light emitting layer.

2. The element according to claim 1 , further comprising

an overflow preventing layer that has a larger bandgap than the barrier layers and prevents holes from overflowing, the overflow preventing layer being provided between the light emitting layer and the n-type GaN layer.

3. A light emitting device comprising:

a support member;

a semiconductor light emitting element according to claim 1 that is supported by the support member;

a resin material that is formed to cover at least part of the semiconductor light emitting element; and

a fluorescent material that is diffused in the resin material, absorbs at least part of light emitted from the semiconductor light emitting element, wavelength-converts the absorbed light, and emits the wavelength-converted light.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 1, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: ALPAD CORPORATION
Reel/Frame 044591/0755 →