Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
Microelectronic die packages, stacked systems of die packages, and methods of manufacturing them are disclosed herein. In one embodiment, a system of stacked packages includes a first die package having a bottom side, a first dielectric casing, and first metal leads; a second die package having a top side attached to the bottom side of the first package, a dielectric casing with a lateral side, and second metal leads aligned with and projecting towards the first metal leads and including an exterior surface and an interior surface region that generally faces the lateral side; and metal solder connectors coupling individual first leads to individual second leads. In a further embodiment, the individual second leads have an “L” shape and physically contact corresponding individual first leads. In another embodiment, the individual second leads have a “C” shape and include a tiered portion that projects towards the lateral side of the second casing.
1. A stacked system of microelectronic die packages, comprising:
a first die package having a first bottom side, the first die package comprising
a first microelectronic die;
a first dielectric casing at least partially covering the first die; and
individual first metal leads coupled to the first die and having a first exterior surface;
a second die package having a second bottom side and a top side adjacent to the first bottom side of the first package, the second die package comprising
a second microelectronic die;
a second dielectric casing at least partially covering the second die and having a lateral side;
individual second metal leads coupled to the second die and having a second exterior surface and an interior surface region that generally faces the lateral side, wherein the individual second leads are at least generally aligned with the individual first leads and project, at least in part, towards the first package; and
a package bond pad at the second bottom side and electrically coupled to the second die and to at least one of the second metal leads;
external inter-package connectors coupling a first portion of individual first exterior surfaces with a second portion of individual second exterior surfaces;
an interposer substrate adjacent to the second bottom surface, the interposer substrate having a substrate bond pad; and
a bond pad connector attached to each of the package bond pad and the substrate bond pad.
2. The stacked system of claim 1 wherein the individual second leads have an L-shape and physically contact corresponding individual first leads.
3. The stacked system of claim 1 wherein the individual second leads have a C-shape and include a tiered portion that projects towards the lateral side of the second casing.
4. The stacked system of claim 1 wherein the individual second leads are coupled to a bottom side of the second casing.
5. The stacked system of claim 1 wherein the bond pad connector comprises a solder ball connector.
6. The stacked system of claim 1 wherein the connectors project laterally outward from the first portion of the first exterior surfaces and the second portion of the second exterior surfaces.
7. The stacked system of claim 6 wherein the connectors further extend in between the first and second die packages, towards the lateral side of the second casing.
8. The stacked system of claim 1 wherein the lateral side of the second casing has a sloped profile and the interior surface regions of the leads are spaced apart from the lateral side by a gap.
9. The stacked system of claim 1 wherein the individual second leads of the second die package are separated from corresponding individual first leads of the first die package by vertical gaps, and wherein individual connectors comprise solder links that bridge the vertical gaps between corresponding pairs of first and second leads.
10. The stacked system of claim 1 wherein the first die has a first lateral dimension and the second die has a second lateral dimension different than the first lateral dimension, and wherein the first and second casings have equal lateral dimensions.
11. A computing system, comprising at least one of a processor, a memory, and an input/output device, wherein the computing system includes the stacked system according to claim 1 .