IP Library › Granted Patent US 8,415,665
Granted Patent B2
US 8,415,665 · App. 12/960,659 · Granted Apr 9, 2013

Semiconductor device and electronic device

Inventors: Hajime Kimura (Atsugi, JP); Atsushi Umezaki (Isehara, JP); Shunpei Yamazaki (Setagaya, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
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Quick Facts
Patent No.
US 8,415,665
App. No.
12/960,659
Granted
Apr 9, 2013
Kind
B2
Abstract

An object is to improve the drive capability of a semiconductor device. The semiconductor device includes a first transistor and a second transistor. A first terminal of the first transistor is electrically connected to a first wiring. A second terminal of the first transistor is electrically connected to a second wiring. A gate of the second transistor is electrically connected to a third wiring. A first terminal of the second transistor is electrically connected to the third wiring. A second terminal of the second transistor is electrically connected to a gate of the first transistor. A channel region is formed using an oxide semiconductor layer in each of the first transistor and the second transistor. The off-state current of each of the first transistor and the second transistor per channel width of 1 μm is 1 aA or less.

Claims (72)

1. A semiconductor device comprising:

a first transistor; and

a second transistor,

wherein a first terminal of the first transistor is electrically connected to a first wiring and a second terminal of the first transistor is electrically connected to a second wiring,

wherein a gate of the second transistor is electrically connected to a third wiring, a first terminal of the second transistor is electrically connected to the third wiring, and a second terminal of the second transistor is electrically connected to a gate of the first transistor,

wherein each of the first transistor and the second transistor comprises an oxide semiconductor layer comprising a channel region, and

wherein an off-state current of each of the first transistor and the second transistor per channel width of 1 μm is 1 aA or less.

2. The semiconductor device according to claim 1 , wherein the oxide semiconductor layer includes a non-single-crystal region.

3. The semiconductor device according to claim 1 , wherein the oxide semiconductor layer includes a non-single-crystal region, the non-single crystal region has a c-axis alignment in a direction perpendicular to a surface of the oxide semiconductor layer.

4. An electronic device comprising:

the semiconductor device according to claim 1 ; and

an operation switch.

5. A semiconductor device comprising:

a first transistor;

a second transistor;

a third transistor; and

a fourth transistor,

wherein a first terminal of the first transistor is electrically connected to a first wiring and a second terminal of the first transistor is electrically connected to a second wiring,

wherein a gate of the second transistor is electrically connected to a third wiring, a first terminal of the second transistor is electrically connected to the third wiring, and a second terminal of the second transistor is electrically connected to a gate of the first transistor,

wherein a gate of the third transistor is electrically connected to a fourth wiring, a first terminal of the third transistor is electrically connected to a fifth wiring, and a second terminal of the third transistor is electrically connected to the second wiring,

wherein a gate of the fourth transistor is electrically connected to the fourth wiring, a first terminal of the fourth transistor is electrically connected to the fifth wiring, and a second terminal of the fourth transistor is electrically connected to the gate of the first transistor,

wherein each of the first to fourth transistors comprises an oxide semiconductor layer comprising a channel region, and

wherein an off-state current of each of the first to fourth transistors per channel width of 1 μm is 1 aA or less.

6. The semiconductor device according to claim 5 , wherein the oxide semiconductor layer includes a non-single-crystal region.

7. The semiconductor device according to claim 5 , wherein the oxide semiconductor layer includes a non-single-crystal region, the non-single crystal region has a c-axis alignment in a direction perpendicular to a surface of the oxide semiconductor layer.

8. An electronic device comprising:

the semiconductor device according to claim 5 ; and

an operation switch.

9. A semiconductor device comprising:

a first transistor and a second transistor,

wherein a first terminal of the first transistor is electrically connected to a first wiring and a second terminal of the first transistor is electrically connected to a second wiring,

wherein a gate of the second transistor is electrically connected to the first wiring, a first terminal of the second transistor is electrically connected to the first wiring, and a second terminal of the second transistor is electrically connected to a gate of the first transistor,

wherein each of the first transistor and the second transistor comprises an oxide semiconductor layer comprising a channel region, and

wherein an off-state current of each of the first transistor and the second transistor per channel width of 1 μm is 1 aA or less.

10. The semiconductor device according to claim 9 , wherein the oxide semiconductor layer includes a non-single-crystal region.

11. The semiconductor device according to claim 9 , wherein the oxide semiconductor layer includes a non-single-crystal region, the non-single crystal region has a c-axis alignment in a direction perpendicular to a surface of the oxide semiconductor layer.

12. An electronic device comprising:

the semiconductor device according to claim 9 ; and

an operation switch.

13. A semiconductor device comprising:

a first transistor;

a second transistor;

a third transistor; and

a fourth transistor,

wherein a first terminal of the first transistor is electrically connected to a first wiring and a second terminal of the first transistor is electrically connected to a second wiring,

wherein a gate of the second transistor is electrically connected to the first wiring, a first terminal of the second transistor is electrically connected to the first wiring, and a second terminal of the second transistor is electrically connected to a gate of the first transistor,

wherein a gate of the third transistor is electrically connected to a third wiring, a first terminal of the third transistor is electrically connected to a fourth wiring, and a second terminal of the third transistor is electrically connected to the second wiring,

wherein a gate of the fourth transistor is electrically connected to the third wiring, a first terminal of the fourth transistor is electrically connected to the fourth wiring, and a second terminal of the fourth transistor is electrically connected to the gate of the first transistor,

wherein each of the first to fourth transistors comprises an oxide semiconductor layer comprising a channel region, and

wherein an off-state current of each of the first to fourth transistors per channel width of 1 μm is 1 aA or less.

14. The semiconductor device according to claim 13 , wherein the oxide semiconductor layer includes a non-single-crystal region.

15. The semiconductor device according to claim 13 , wherein the oxide semiconductor layer includes a non-single-crystal region, the non-single crystal region has a c-axis alignment in a direction perpendicular to a surface of the oxide semiconductor layer.

16. An electronic device comprising:

the semiconductor device according to claim 13 ; and

an operation switch.

17. A semiconductor device comprising:

a first transistor;

a second transistor;

N third transistors, where N is a natural number; and

N fourth transistors,

wherein a first terminal of the first transistor is electrically connected to a first wiring and a second terminal of the first transistor is electrically connected to a second wiring,

wherein a gate of the second transistor is electrically connected to the first wiring, a first terminal of the second transistor is electrically connected to the first wiring, and a second terminal of the second transistor is electrically connected to a gate of the first transistor,

wherein each gate of the N third transistors and each gate of the N fourth transistors are electrically connected to one of an N third wiring, respectively,

wherein first terminals of the N third transistors are electrically connected to a fourth wiring, and second terminals of the N third transistors are electrically connected to the second wiring,

wherein first terminals of the N fourth transistors are electrically connected to the fourth wiring, and second terminals of the N fourth transistors are electrically connected to the gate of the first transistor,

wherein each of the first transistor, the second transistor, the N third transistors, and the N fourth transistors comprises an oxide semiconductor layer comprising a channel region, and

wherein an off-state current of each of the first transistor, the second transistor, the N third transistors, and the N fourth transistors per channel width of 1 μm is 1 aA or less.

18. The semiconductor device according to claim 17 , wherein the oxide semiconductor layer includes a non-single-crystal region.

19. The semiconductor device according to claim 17 , wherein the oxide semiconductor layer includes a non-single-crystal region, the non-single crystal region has a c-axis alignment in a direction perpendicular to a surface of the oxide semiconductor layer.

20. An electronic device comprising:

the semiconductor device according to claim 17 ; and

an operation switch.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2010
From: KIMURA, HAJIME; UMEZAKI, ATSUSHI; YAMAZAKI, SHUNPEI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 025450/0858 →
Priority Claims (1)
JP 2009-282268 · Dec 11, 2009 · national
Continuity (1)
Related Publication 20110140108A1 · Jun 16, 2011