Surface plasmon dispersion engineering via double-metallic AU/AG layers for nitride light-emitting diodes
A double-metallic deposition process is used whereby adjacent layers of different metals are deposited on a substrate. The surface plasmon frequency of a base layer of a first metal is tuned by the surface plasmon frequency of a second layer of a second metal formed thereon. The amount of tuning is dependent upon the thickness of the metallic layers, and thus tuning can be achieved by varying the thicknesses of one or both of the metallic layers. In a preferred embodiment directed to enhanced LED technology in the green spectrum regime, a double-metallic Au/Ag layer comprising a base layer of gold (Au) followed by a second layer of silver (Ag) formed thereon is deposited on top of InGaN/GaN quantum wells (QWs) on a sapphire/GaN substrate.
1. A method of fabricating an InGaN quantum well LED having a tunable surface plasmon frequency, comprising:
forming a GaN substrate;
forming a first metallic layer of a first metallic material on said substrate, said first metallic layer having a first surface plasmon frequency and having a first thickness; and
forming a second metallic layer of a second metallic material on said first metallic layer, said second metallic layer having a second surface plasmon frequency that is higher than said first surface plasmon frequency and having a second thickness; and
tuning the plasmon frequency of said LED to a predetermined value by selecting a predetermined ratio of said first thickness to said second thickness.
2. The method as set forth in claim 1 , wherein said first metallic material comprises gold.
3. The method as set forth in claim 2 , wherein said second metallic material comprises silver.
4. The method as set forth in claim 3 , wherein a ratio of gold thickness to silver thickness is selected so that the surface plasmon frequency of said LED is the green spectral regime.
5. The method as set forth in claim 3 , wherein a ratio of gold thickness to silver thickness is selected so that the surface plasmon frequency of said LED is in the range of about 420 nm to 560 nm.
6. The method as set forth in claim 5 , wherein a ratio of gold thickness to silver thickness is selected so that the surface plasmon frequency of said LED is in the range of about 510 nm to 550 nm.
7. The method as set forth in claim 5 , wherein a ratio of gold thickness to silver thickness is selected so that the surface plasmon frequency of said LED is about 520 nm.
8. The method as set forth in claim 5 , wherein a ratio of gold thickness to silver thickness is selected so that the surface plasmon frequency of said LED is about 530 nm.
9. The method as set forth in claim 5 , wherein a ratio of gold thickness to silver thickness is selected so that the surface plasmon frequency of said LED is about 540 nm.
10. The method as set forth in claim 5 , wherein a ratio of gold thickness to silver thickness is selected so that the surface plasmon frequency of said LED is about 550 nm.
11. The method as set forth in claim 1 , wherein a ratio of a thickness of said first metallic layer to a thickness of said second metallic layer is selected so that the surface plasmon frequency of said LED is in the range of about 200 nm to 1 micron.