Method for fluid processing a workpiece

1. A method of fluid processing a semiconductor workpiece, comprising:

disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece;

providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder; and

agitating the fluid by moving the member substantially parallel to a surface of the workpiece with an oscillatory motion, the oscillatory motion being a series of substantially continuous oscillations, wherein each consecutive oscillation of the series includes a first stroke and an opposing second stroke and wherein the first stroke includes a starting point and an ending point, and the second stroke includes a starting point and an ending point, and the ending point of the first stroke coincides with the starting point of the second stroke to thereby define a reversal position, and further wherein the second stroke is not symmetrical to the first stroke with respect to the reversal position such that each oscillation is asymmetrical, and further wherein the starting point of the first stroke is offset from the ending point of the second stroke.

2. The method of claim 1 further comprising continuously changing a center position of each stroke such that a center of the first stroke is offset from a center of the second stroke, and centers of each of a plurality of immediately succeeding strokes are offset from centers of each of their respective immediately preceding strokes.

3. The method of claim 1 further comprising matching the length of the first stroke to the separation of spaced openings defined by the member.

4. The method of claim 1 further comprising reducing electric field imaging of the member on the surface of the workpiece via the oscillatory motion.

5. The method of claim 1 further comprising reducing fluid flow imaging of the member on the surface of the workpiece via the oscillatory motion of the member.

6. The method of claim 1 further comprising shaping an electric field incident on a surface of the workpiece using a plate disposed adjacent the member.

7. The method of claim 1 further comprising removing gas bubbles entrapped in the fluid from the surface of the workpiece.

8. The method of claim 1 further comprising forming a non-periodic fluid boundary layer at a surface of the workpiece via the oscillatory motion of the member.

9. The method of claim 1 further comprising reducing a fluid boundary layer thickness at the surface of the workpiece via the oscillatory motion of the member.

10. The method of claim 9 further comprising reducing the fluid boundary layer thickness to less than about 10 μm.

11. The method of claim 1 further comprising positioning the member less than about 2 mm from a surface of the workpiece.

12. The method of claim 1 further comprising depositing a metal or plastic on a surface of the workpiece.

13. The method of claim 1 further comprising dissoluting a metal or a plastic on a surface of the workpiece.

14. The method of claim 1 wherein the member defines a plurality of spaced openings.

15. The method of claim 14 further comprising agitating the fluid using oscillatory motion of the plurality of spaced openings of the member.

16. The method of claim 1 , wherein a first plurality of oscillations form a first cycle of oscillations, and wherein said first cycle includes a first maximum reversal position, in which reversal positions immediately before and immediately after the first maximum reversal position are lower than the first maximum reversal position;

wherein a second plurality of oscillations form a second cycle of oscillations, and wherein said second cycle of oscillations includes a second maximum reversal position, in which reversal positions immediately before and immediately after the second maximum reversal position are lower than the second maximum reversal position; and

wherein said first maximum reversal position is offset from said second maximum reversal position.

17. The method of claim 16 , wherein successive cycles of oscillations each have a maximum reversal position which is offset from a respective maximum reversal position of an immediately preceding cycle.

18. A method for fluid processing a semiconductor workpiece, comprising:

disposing a means for retaining the workpiece in a housing capable of containing fluid;

providing a means for agitating the fluid; and

moving the means for agitating the fluid in an oscillatory motion substantially parallel to a surface of the workpiece, the oscillatory motion being a series of substantially continuous oscillations including a first oscillation having a first stroke and an opposing second stroke, and wherein the first stroke includes a starting point and an ending point, and the second stroke includes a starting point and an ending point; and

wherein the ending point of the first stroke corresponds to the starting point of the second stroke and thereby provides a stroke reversal position of the first oscillation;

wherein the starting point of the first stroke is offset from the ending point of the second stroke;

wherein the substantially continuous oscillations further include a second oscillation immediately following the first oscillation, the second oscillation including a third stroke and an opposing fourth stroke, the third stroke having a starting point corresponding to the ending point of the second stroke, the third stroke having an ending point corresponding to a starting point of the fourth stroke to thereby provide a stroke reversal position of the second oscillation, and wherein the fourth stroke includes an ending point;

wherein the starting point of the third stroke is offset from the ending point of the fourth stroke; and

wherein the reversal position of the first oscillation is offset from the reversal position of the second oscillation.

19. The method of claim 18 , further comprising providing a means defining a plurality of holes having a distribution of hole sizes for varying an electric field incident on the surface of the workpiece.

20. The method of claim 18 , wherein a first plurality of oscillations form a first cycle of oscillations, and wherein said first cycle includes a first maximum reversal position, in which reversal positions immediately before and immediately after the first maximum reversal position are lower than the first maximum reversal position;

wherein a second plurality of oscillations form a second cycle of oscillations, and wherein said second cycle of oscillations includes a second maximum reversal position, in which reversal positions immediately before and immediately after the second maximum reversal position are lower than the second maximum reversal position; and

wherein said first maximum reversal position is offset from said second maximum reversal position.