High performance low profile QFN/LGA
View Patent ↗A method for manufacturing a semiconductor device is disclosed. In one embodiment a semiconductor die is formed overlying a substrate. The semiconductor die is flip chip mounted to the substrate, wherein the substrate comprises a plurality of conductive traces. The semiconductor die and substrate are encapsulated with an encapsulating material. A top side of the encapsulating material is subjected to one of polishing, etching, and grinding to expose a top side of the semiconductor die. Finally, the bottom side of the substrate is subjected to one of polishing, etching, and grinding to remove the substrate and to reduce a thickness of the plurality of conductive traces.
1. A method for manufacturing a semiconductor device comprising:
flip chip mounting a first side of a semiconductor die to a substrate comprising a plurality of conductive traces, wherein a second side of the semiconductor die is subjected to one of polishing, etching, and grinding to reduce a thickness of the semiconductor die to be no greater than 2 mils prior to the flip chip mounting;
encapsulating the semiconductor die and substrate with an encapsulating material;
subjecting a top side of the encapsulating material to one of polishing, etching, and grinding to expose the second side of the semiconductor die;
subjecting the bottom side of the substrate to one of polishing, etching, and grinding to remove the substrate; and
reducing a thickness of the plurality of conductive traces by continuing the one of polishing, etching, and grinding after the substrate has been removed, wherein the substrate is removed and then the thickness of the plurality of conductive traces is reduced in one continuous step.
2. The method for manufacturing a semiconductor device according to claim 1 , further comprising one of polishing, etching, and grinding the second side of the semiconductor die to reduce a thickness of the semiconductor die after the second side of the semiconductor die has been exposed.
3. The method for manufacturing a semiconductor device according to claim 1 , wherein the encapsulating material is formed from an epoxy mold compound.
4. The method for manufacturing a semiconductor device according to claim 1 , wherein the semiconductor die and the conductive traces are electrically connected with flip chip interconnections.
5. The method for manufacturing a semiconductor device according to claim 1 , wherein flip chip interconnections are gold bumps.
6. The method for manufacturing a semiconductor device according to claim 1 , wherein the conductive traces are formed of copper.
7. The method for manufacturing a semiconductor device according to claim 1 , wherein the conductive traces are subjected to one of a mild acid and fine polishing after the thickness of the plurality of conductive traces has been reduced to de-smear the conductive traces.
8. A method for manufacturing a semiconductor device comprising:
flip chip mounting a first side of a semiconductor die to a substrate comprising a plurality of conductive traces, wherein a second side of the semiconductor die is subjected to one of polishing, etching, and grinding to reduce a thickness of the semiconductor to be no greater than 2 mils die prior to the flip chip mounting;
encapsulating the semiconductor die and substrate with an encapsulating material;
subjecting a top side of the encapsulating material to one of polishing, etching, and grinding to expose the second side of the semiconductor die and to reduce a thickness of the semiconductor die; and
subjecting the bottom side of the substrate to one of polishing, etching, and grinding to completely remove the substrate and to reduce a thickness of the plurality of conductive traces and continuing the one of polishing, etching, and grinding after the substrate has been removed to reduce a thickness of the plurality of conductive traces, wherein the substrate is removed and then the thickness of the plurality of conductive traces is reduced in one continuous step.
9. The method for manufacturing a semiconductor device according to claim 8 , wherein the encapsulating material is formed from an epoxy mold compound.
10. The method for manufacturing a semiconductor device according to claim 8 , wherein the semiconductor die and the conductive traces are electrically connected with flip chip interconnections.
11. The method for manufacturing a semiconductor device according to claim 10 , wherein the flip chip interconnections are gold bumps.
12. The method for manufacturing a semiconductor device according to claim 8 , wherein the conductive traces are formed of copper.
13. The method for manufacturing a semiconductor device according to claim 12 , wherein the copper traces are subjected to one of a mild acid and fine polishing after the thickness of the plurality of conductive traces has been reduced to de-smear the copper traces.