Homogeneous liquid cooling of LED array
A liquid-cooled heat sink includes a top plate having an array of circuitous liquid channels, each channel having a separate channel inlet and a common central outlet channel. The heat sink further includes a bottom plate having an inlet port and an outlet port. The heat sink further includes an intermediate plate having inlet guide channels providing fluid communication between the inlet port of the bottom plate and channel inlets of the top plate, said intermediate plate further including an outlet guide channel providing fluid communication between the common central outlet channel of the top plate and the outlet port of the bottom plate.
1. A liquid-cooled heat sink comprising:
a base plate;
a middle plate; and
a top plate;
wherein the base plate and the middle plate are stacked and attached together to form a base layer of the heat sink;
wherein the middle plate and the top plate are attached together to form a top layer of the heat sink;
wherein the surface of the top plate not facing the middle plate is a target cooled surface;
wherein the base layer has a channel distributing a liquid from a heat sink inlet on the base plate to a plurality of inlets on the middle plate, each of the plurality of inlets directing the liquid to a corresponding circuitous channel in the top layer;
wherein each of the circuitous channels directs the liquid in a circuitous path, in a plane adjacent to the target cooled surface, cooling the surface; and
wherein the circuitous channels merge at an aggregation point among the circuitous channels, the aggregation point being connected to a heat sink outlet directing the liquid from the top layer back to the base layer and out of the heat sink,
wherein the top plate, the middle plate, and the base plate are formed of ceramic,
wherein the channel steers the liquid through four inlets on the plate and into four circuitous cooling channels, wherein each of the circuitous cooling channels directs the liquid from a central point of the channel of the base plate layer and progressively farther away as the channel revolves around the central point in a spiral configuration, and then the liquid is directed by the circuitous cooling channels to the central point of the top plate and the liquid then exits the liquid-cooled heat sink via a heat sink outlet, wherein the heat sink outlet is formed by aligning the outlet on the base plate with an outlet on additional plate when the base plate and the additional plate are stacked together.
2. The liquid-cooled heat sink of claim 1 , wherein the circuitous cooling channels are shaped like spirals and the circuitous path traced by the liquid in the circuitous cooling channel is defined by walls perpendicular to the target cooled surface.
3. The liquid-cooled heat sink of claim 1 , wherein each of the circuitous paths is defined by walls perpendicular to the target cooled surface.
4. The liquid-cooled heat sink of claim 1 , the middle plate further comprising a middle plate opening aligned with the second base plate opening to form the heat sink outlet.
5. The liquid-cooled heat sink of claim 1 , the base plate further comprising a wall perpendicular to the base plate and surrounding the second base plate opening, the wall being flush against the middle plate when the base plate and the middle plate are attached together, thereby preventing the liquid from flowing from the chamber inside the base layer to the second base plate opening.
6. The liquid-cooled heat sink of claim 1 , wherein the channel inside the base layer is defined by the rim of the base plate and the wall.
7. The liquid-cooled heat sink of claim 1 , wherein the number of circuitous channels is at least four.
8. The liquid-cooled heat sink of claim 7 , wherein the circuitous channels are laid out in a two by two array.
9. The liquid-cooled heat sink of claim 1 , wherein the top plate is formed of ceramic.
10. The liquid-cooled heat sink of claim 1 , wherein the top plate, the middle plate, and the base plate are formed of ceramic.