Capacitor for semiconductor device and manufacturing method of capacitor for semiconductor device
View Patent ↗Disclosed are a capacitor for a semiconductor device and a manufacturing method thereof. The capacitor includes a second oxide layer filling a first trench in a semiconductor substrate; second and third trenches in an active region at opposing sides of the second oxide layer in the first trench; a third oxide layer on the semiconductor substrate and on inner surfaces of the second and third trenches; and a polysilicon layer on the third oxide layer to fill the second and third trenches.
1. A capacitor for a semiconductor device, the capacitor comprising;
a second oxide layer filling a first trench in a semiconductor substrate;
a second trench and a third trench in an active region at opposing sides of the second oxide layer in the first trench;
a third oxide layer on the semiconductor substrate and on inner surfaces of the second and third trenches;
an HTO (High Temperature Oxide) layer or an N 2 doping layer between the third oxide layer and the semiconductor substrate; and
a polysilicon layer on the third oxide layer and filling the second and third trenches;
wherein the second and the third trenches are fully enclosed by the semiconductor substrate which comprises only one type of dopant ion.
2. The capacitor of claim 1 , wherein partition walls formed by the semiconductor substrate are provided between the first and second trenches and between first and third trenches.
3. The capacitor of claim 1 , wherein a part of the semiconductor substrate remains between the polysilicon layer filling the second and third trenches and the second oxide layer.
4. The capacitor of claim 1 , wherein a part of the semiconductor substrate is concavely rounded at a region corresponding to upper portions of the second and third trenches.
5. The capacitor of claim 1 , wherein an upper portion of a lateral side of the polysilicon layer filling the second and third trenches has a rounded extension.
6. The capacitor of claim 1 , wherein a depth of the second oxide layer in the semiconductor substrate is at least ⅓ a depth of the polysilicon layer filling the second and third trenches.
7. The capacitor of claim 1 , further comprising an ion implantation layer between the third oxide layer and the semiconductor substrate.
8. The capacitor of claim 1 , wherein the polysilicon layer is prepared in a form of a mesh and electrically connects to a plurality of active regions.
9. The capacitor of claim 1 , further comprising a gate insulating layer and a gate of a transistor on a portion of the active region extending from a capacitor area having the second and third trenches, wherein the gate insulating layer is formed from patterning the third oxide layer and the gate is formed from patterning the polysilicon layer.
10. A method of manufacturing a capacitor for a semiconductor device, the method comprising:
forming a first trench in a semiconductor substrate and forming a second oxide layer in the first trench;
forming second and third trenches in an active region at opposing sides of the second oxide layer in the first trench;
forming a third oxide layer on the semiconductor substrate and on inner surfaces of the second and third trenches;
forming a polysilicon layer on the third oxide layer such that the second and third trenches are filled with the polysilicon layer;
wherein the second and the third trenches are fully enclosed by the semiconductor substrate which comprises only one type of dopant ion;
wherein the forming of the second oxide layer in the first trench comprises:
forming a first oxide layer on the semiconductor substrate;
forming a first nitride layer on the first oxide layer;
forming the first trench by partially removing the first oxide layer, the first nitride layer, and the semiconductor substrate;
forming the second oxide layer on the first nitride layer such that the first trench is filled with the second oxide layer;
planarizing the second oxide layer until the first nitride layer is exposed;
removing the first nitride layer, thereby forming the second oxide layer in the first trench;
forming a second nitride layer on the second oxide layer after the first nitride layer is removed; and
forming a fourth oxide layer on the second nitride layer.
11. The method of claim 10 , wherein the forming of the second and third trenches comprises using the second nitride layer and the fourth oxide layer as a self-aligned hard mask.
12. The method of claim 11 , further comprising concavely rounding an upper portion of the semiconductor substrate before the second and third trenches are formed.
13. The method of claim 12 , wherein the concavely rounding of the upper portion of the semiconductor substrate comprises:
forming a fifth oxide layer on the semiconductor substrate;
forming a spacer fifth oxide layer by blanket etching the fifth oxide layer; and
rounding the upper portion of the semiconductor substrate by performing a chemical dry etching (CDE) with respect to the exposed semiconductor substrate by using the spacer fifth oxide layer, the second nitride layer and the fourth oxide layer as a hard mask.
14. The method of claim 10 , wherein sidewalls of the second and third trenches are inclined at a predetermined angle, and partition walls formed by the semiconductor substrate are provided between the first and second trenches and between first and third trenches.
15. The method of claim 10 , further comprising forming an ion implantation layer around the second and third trenches before forming the third oxide layer.
16. The method of claim 10 , further comprising patterning the third oxide layer and the polysilicon layer on a portion of the active region extending from a capacitor area having the second and third trenches to form a gate insulating layer from the third oxide layer and a gate of a transistor from the polysilicon layer.