Semiconductor device
View Patent ↗Various embodiments of the present invention include a semiconductor device and a fabrication method therefor, the semiconductor device including a first semiconductor chip disposed on a substrate, a first sealing resin sealing the first semiconductor chip, a built-in semiconductor device disposed on the first sealing resin, and a second sealing resin sealing the first sealing resin and the built-in semiconductor device and covering a side surface of the substrate. According to an aspect of the present invention, it is possible to provide a high-quality semiconductor device and a fabrication method therefor, in which downsizing and cost reduction can be realized.
1. A semiconductor device comprising:
a first semiconductor chip disposed on a first surface of a first substrate, the first substrate comprises a second surface opposing the first surface;
a first resin sealing the first semiconductor chip;
a built-in semiconductor device comprising:
a second substrate;
a second semiconductor chip disposed on the second substrate; and
a second resin sealing the second semiconductor chip, the second resin of the built-in semiconductor device disposed on the first resin; and
a third resin sealing the first resin and the built-in semiconductor device and covering a side surface of the first substrate and not extending beyond the second surface of the first substrate.
2. The semiconductor devices of claim 1 , further comprising a solder bump on the second surface of the first substrate.
3. The semiconductor device of claim 1 , wherein the first semiconductor chip is disposed on the first surface of the first substrate with a die attach material.
4. The semiconductor device of claim 3 , wherein the second semiconductor chip is disposed on the second substrate with a die attach material.
5. The semiconductor device of claim 4 , wherein the second resin of the built-in semiconductor device is disposed on the first resin with an adhesive.
6. The semiconductor device of claim 1 , wherein the second semiconductor chip is disposed on the second substrate with a die attach material.
7. The semiconductor device of claim 1 , wherein the second resin of the built-in semiconductor device is disposed on the first resin with an adhesive.
8. The semiconductor device of claim 1 , wherein the second semiconductor chip is electrically coupled to the second substrate by a wire.
9. The semiconductor device of claim 1 , wherein the second semiconductor chip is located between the first and second substrates.
10. The semiconductor device of claim 1 , wherein the first substrate is reverse wire bonded to the built-in semiconductor device.
11. A semiconductor device comprising:
a first semiconductor chip attached on a first surface of a first substrate, the first substrate comprises a second surface opposing the first surface;
a first resin sealing the first semiconductor chip;
a built-in semiconductor device comprising:
a second substrate;
a second semiconductor chip attached on the second substrate; and
a second resin sealing the second semiconductor chip, the second resin of the built-in semiconductor device attached on the first resin; and
a third resin sealing the first resin and the built-in semiconductor device and covering a side surface of the first substrate and not extending beyond the second surface of the first substrate.
12. The semiconductor device of claim 11 , wherein the second semiconductor chip is located between the first and second substrates.
13. The semiconductor device of claim 11 , wherein the second semiconductor chip is electrically coupled to the second substrate by a first wire.
14. The semiconductor device of claim 13 , wherein the second substrate is electrically coupled to the first substrate by a second wire.
15. The semiconductor device of claim 13 , wherein the first substrate is reverse wire bonded to the built-in semiconductor device.
16. The semiconductor device of claim 11 , wherein the built-in semiconductor device is electrically coupled to the first substrate by a wire.
17. The semiconductor device of claim 11 , wherein the first substrate is reverse wire bonded to the built-in semiconductor device.
18. The semiconductor device of claim 11 , wherein the first semiconductor chip is attached on the first surface of the first substrate with a die attach material.
19. The semiconductor device of claim 11 , wherein the second semiconductor chip is attached on the second substrate with a die attach material.
20. The semiconductor device of claim 11 , wherein the second resin of the built-in semiconductor device is attached on the first resin with an adhesive.