Method of manufacturing a bulk acoustic wave device
View Patent ↗A method of manufacturing a Bulk Acoustic Wave device by providing an active layer formed of an electro-mechanical transducer material, providing a first electrode on the active layer, defining a first electrode portion of the device, whereby a remaining portion of the device is defined around the first electrode, providing a stop-layer on the first electrode, depositing a first dielectric layer on the resultant structure, and planarizing the first dielectric layer until the stop-layer on the first electrode is exposed.
1. A method of manufacturing a Bulk Acoustic Wave device, comprising:
providing an active layer formed of a piezoelectric transducer material;
providing a first electrode on the active layer, defining a first electrode portion of the device, whereby a remaining portion of the device is defined around the first electrode;
providing a stop-layer on the first electrode to obtain a resultant structure;
depositing a first dielectric layer on the resultant structure; and
planarizing the first dielectric layer until at least a portion of the stop-layer on the first electrode is exposed.
2. The method of claim 1 , further comprising removing the stop-layer by etching.
3. The method of claim 1 , wherein a deposited thickness of the first dielectric layer in the remaining portion is less than a thickness of the first electrode.
4. The method of claim 1 , wherein a deposited thickness of the first dielectric layer in the remaining portion is greater than a thickness of the first electrode.
5. The method of claim 4 , wherein the deposited thickness of the dielectric layer in the remaining portion is greater than a combined thickness of the first electrode and the stop-layer, whereby part of the dielectric layer in the remaining portion is removed by the planarization.
6. The method of claim 1 , wherein the step of providing the first electrode comprises:
providing a conductive layer on the active layer; and
patterning the conductive layer by etching to define the first electrode, wherein the etching of the conductive layer includes:
a first anisotropic etching step; followed by
a second isotropic etching step.
7. The method of claim 1 , further comprising depositing a second dielectric layer on the first dielectric layer, wherein the second dielectric layer is formed of a material having a different acoustic impedance than the first dielectric layer.
8. The method of claim 1 , further comprising depositing an additional layer on the first electrode.
9. The method of claim 1 ,
wherein the Bulk Acoustic Wave device is adapted for acoustic coupling of signals at frequencies in a desired pass-band, and
wherein a thickness of the first dielectric layer in the remaining portion is adapted such that the wave number for at least one desired eigenmode having an eigenfrequency within the pass-band is an imaginary number, so as to increase the quality factor of said desired eigenmode and reduce insertion loss in the pass-band.
10. The method of claim 1 , further comprising providing a second electrode on the active layer, defining a second electrode portion of the device, whereby a gap portion of the device is defined between the first and second electrodes and the remaining portion of the device is defined around the electrodes.
11. The method of claim 10 , further comprising adjusting a thickness of the first dielectric layer in the gap portion or a thickness of the first dielectric layer in the remaining portion, so that they are different.
12. The method of claim 10 ,
wherein the Bulk Acoustic Wave device is adapted for acoustic coupling of signals at frequencies in a desired pass-band,
wherein a thickness of the first dielectric layer in the gap portion is adapted such that the wave number for at least one desired eigenmode having an eigenfrequency within the pass-band is a real number.
13. The method of claim 1 , wherein planarizing the first dielectric layer comprises Chemical Mechanical Polishing (CMP).