IP Library Assignment 044644/0207
Patent Assignment
Reel/Frame 044644/0207

Assignment of Assignor's Interest

Recorded: 2018-01-17 Pages: 10
Assignor
NXP B.V.
Executed: 2017-12-04
Assignee
VLSI TECHNOLOGY LLC
1209 ORANGE STREET, WILMINGTON, DELAWARE, 19801
Covered Properties (13)
A Method of Operating a Programmable, Non-Volatile Memory Device
Patent: 6,291,836 →
Application: 08/866,649 →
Secure Data Communication Over a Memory-Mapped Serial Communications Interface Utilizing a Distributed Firewall
Patent: 6,212,633 →
Application: 09/105,285 →
Current Comparator
Patent: 6,147,518 →
Application: 09/162,838 →
Method and Apparatus for Improved Copper Plating Uniformity on a Semiconductor Wafer Using Optimized Electrical Currents
Patent: 6,193,860 →
Application: 09/298,629 →
Method of Manufacturing a Semiconductor Device
Patent: 6,174,759 →
Application: 09/304,412 →
Methods for Converting Features to a Uniform Micron Technology in an Integrated Circuit Design and Apparatus for Doing the Same
Patent: 6,470,477 →
Application: 09/470,779 →
Semiconductor Device
Patent: 6,326,661 →
Application: 09/616,630 →
Method for Improving Inversion Layer Mobility in a Silicon Carbide Metal-Oxide Semiconductor Field-Effect Transistor
Patent: 6,559,068 →
Application: 09/894,089 →
Publication: US 2003/0008442
Method and Device to Form High Quality Oxide Layers of Different Thickness in One Processing Step
Patent: 7,829,411 →
Application: 10/503,046 →
Publication: US 2005/0079732
Metal Etching Method for an Interconnect Structure and Metal Interconnect Structure Obtained by Such Method
Patent: 7,768,129 →
Application: 10/544,607 →
Publication: US 2006/0148251
Fuse Structure Having Reduced Heat Dissipation Towards the Substrate
Patent: 7,537,969 →
Application: 10/572,422 →
Publication: US 2007/0087543
Method of Manufacturing a Bulk Acoustic Wave Device
Patent: 8,409,996 →
Application: 12/968,020 →
Publication: US 2011/0315654
Multilevel Interconnection System
Patent: 8,888,504 →
Application: 13/264,892 →
Publication: US 2012/0045909
Related Assignments (6)
Other recorded transfers of the patents in this record — the chain of ownership.
Release of Security Interest Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC
To: NXP B.V.
Reel/Frame 050315/0443 →
Release of Security Interest Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 042985 Frame 0001. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 042762 Frame 0145. Assignor(S) Hereby Confirms the Security Agreement Supplement. Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →