Granted Patent
Utility
US 6,193,860 · App. 09/298,629
Method and apparatus for improved copper plating uniformity on a semiconductor wafer using optimized electrical currents
Inventor:
Milind Weling
Patented Case
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Granted: Feb 27, 2001
Filed: Apr 23, 1999
Inventor
Milind Weling
Assignee (at issue)
VLSI Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.