SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
In a blue-violet semiconductor laser device, a pair of side surfaces of a semiconductor device structure composed of a nitride based semiconductor layer is respectively positioned inside a pair of side surfaces of a partial substrate composed of a Ge substrate. This causes the pair of side surfaces of the semiconductor device structure and the pair of side surfaces of the partial substrate to be respectively spaced apart from each other by a predetermined distance in a direction perpendicular to the pair of side surfaces of the semiconductor device structure. On the partial substrate, current blocking layers are formed in a region between the pair of side surfaces of the partial substrate and the pair of side surfaces of the semiconductor device structure.
1 .- 20 . (canceled)
21 . A semiconductor device comprising:
a supporting substrate having a supporting surface and a pair of first side surfaces;
a semiconductor layer provided on said supporting surface of said supporting substrate and having a pair of second side surfaces respectively positioned inside said pair of first side surfaces of said supporting substrate;
an insulating layer formed so as to cover a region of said supporting surface between said pair of first side surfaces of said supporting substrate and said pair of second side surfaces of said semiconductor layer; and
a metal layer formed between said supporting substrate and said semiconductor layer and between said supporting substrate and said insulating layer, wherein
said insulating layer is formed so as to extend between said metal layer and said semiconductor layer.
22 . The semiconductor device according to claim 21 , wherein said semiconductor layer includes a light emitting layer that emits a light beam.
23 . The semiconductor device according to claim 22 , wherein said insulating layer is formed on a side surface of said light emitting layer.
24 . The semiconductor device according to claim 22 , wherein said semiconductor layer has a projection on the side of said supporting substrate, and said light emitting layer is formed in said projection.
25 . The semiconductor device according to claim 21 , wherein
said semiconductor layer includes a semiconductor layer of a first conductivity type and a semiconductor layer of a second conductivity type, on the side of said supporting substrate, on said semiconductor layer of a first conductivity type, and
said insulating layer is formed on a side surface of a junction between said semiconductor layer of a first conductivity type and said semiconductor layer of a second conductivity type.
26 . The semiconductor device according to claim 21 , wherein
said semiconductor layer has a projection on the side of said supporting substrate,
said semiconductor layer includes a semiconductor layer of a first conductivity type and a semiconductor layer of a second conductivity type, on the side of said supporting substrate, on said semiconductor layer of a first conductivity type, and
said projection includes said semiconductor layer of a first conductivity type and said semiconductor layer of a second conductivity type.
27 . The semiconductor device according to claim 21 , wherein said semiconductor layer includes a light emitting layer that emits a light beam, and
said light emitting layer includes a cavity that performs lasing.
28 . The semiconductor device according to claim 27 , wherein
said semiconductor layer includes a second semiconductor layer, on the side of said supporting substrate, on said light emitting layer,
said second semiconductor layer has a projection and flat portions on both side of said projection, and
said insulating layer is formed on a side surface of said projection and said flat portions, excluding an upper surface of said projection.
29 . The semiconductor device according to claim 21 , wherein
said supporting substrate further has a pair of third side surfaces crossing said pair of first side surfaces,
said semiconductor layer further has a pair of fourth side surfaces crossing said pair of second side surfaces and respectively positioned inside said pair of third side surfaces of said supporting substrate, and
said insulating layer is formed so as to cover a region of said supporting surface between said pair of third side surface of said supporting substrate and said pair of fourth side surfaces of said semiconductor layer.
30 . The semiconductor device according to claim 21 , wherein said semiconductor layer includes a nitride based semiconductor.
31 . The semiconductor device according to claim 21 , wherein said supporting substrate is a germanium substrate.
32 . The semiconductor device according to claim 21 , wherein said insulating layer is composed of silicon oxide or silicon nitride.
33 . The semiconductor device according to claim 21 , wherein said metal layer is composed of any of a solder composed of gold and tin, a solder composed of gold and germanium, and a conductive paste composed of silver.
34 . The semiconductor device according to claim 24 , wherein said projection is formed in a striped shape.