IP Library Granted Patent US 8,411,513
Granted Patent B2
US 8,411,513 · App. 12/974,939 · Granted Apr 2, 2013

Techniques for providing a semiconductor memory device having hierarchical bit lines

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Quick Facts
Patent No.
US 8,411,513
App. No.
12/974,939
Granted
Apr 2, 2013
Kind
B2
Abstract

Techniques for providing a semiconductor memory device having hierarchical bit lines are disclosed. In one particular exemplary embodiment, the techniques may be realized as a semiconductor memory device including a plurality of memory cells and a plurality of local bit lines coupled directly to the plurality of memory cells. The semiconductor memory device may also include a multiplexer coupled to the plurality of local bit lines and a global bit line coupled to the multiplexer.

Claims (23)

1. A semiconductor memory device comprising:

a plurality of memory cells;

a plurality of local bit lines coupled directly to the plurality of memory cells;

a multiplexer coupled to the plurality of local bit lines, wherein the multiplexer comprises a plurality of hold transistors each configured to apply a holding signal to a respective memory cell during a hold operation; and

a global bit line coupled to the multiplexer.

2. The semiconductor memory device according to claim 1 , wherein four local bit lines are coupled directly to the multiplexer.

3. The semiconductor memory device according to claim 1 , wherein the multiplexer is coupled to a global hold line.

4. The semiconductor memory device according to claim 1 , wherein the multiplexer is coupled to a global mask line.

5. The semiconductor memory device according to claim 1 , wherein the multiplexer further comprises a plurality of selection transistors.

6. The semiconductor memory device according to claim 5 , wherein the plurality of selection transistors are coupled to the plurality of memory cells via the plurality of local bit lines.

7. The semiconductor memory device according to claim 5 , wherein the plurality of selection transistors are coupled to the global bit line.

8. The semiconductor memory device according to claim 5 , wherein each of the plurality of selection transistors is coupled to a respective one of the plurality of memory cells.

9. The semiconductor memory device according to claim 1 , wherein the plurality of hold transistors are coupled to the plurality of local bit lines.

10. The semiconductor memory device according to claim 9 , wherein each of the plurality of hold transistors are coupled to a respective one of the plurality of local bit lines.

11. The semiconductor memory device according to claim 1 , wherein the plurality of hold transistors are coupled to a global hold line.

12. The semiconductor memory device according to claim 1 , wherein the multiplexer further comprises a plurality of mask transistors.

13. The semiconductor memory device according to claim 12 , wherein each of the plurality of mask transistors is coupled to a respective one of the plurality of local bit lines.

14. The semiconductor memory device according to claim 12 , wherein the plurality of mask transistors are coupled to a global mask line.

15. The semiconductor memory device according to claim 1 , wherein the multiplexer further comprises a plurality of selection transistors and a plurality of mask transistors.

16. The semiconductor memory device according to claim 15 , wherein each of the plurality of selection transistors, each of the plurality of mask transistors, and each of the plurality of hold transistors is directly coupled to a respective one of the plurality of local bit lines.

17. The semiconductor memory device according to claim 15 , wherein the plurality of mask transistors are coupled to a global mask line and the plurality of hold transistors are coupled to a global hold line.

18. The semiconductor memory device according to claim 17 , wherein the global mask line is configured between adjacent global bit lines.

19. The semiconductor memory device according to claim 17 , wherein the global hold line is configured between adjacent global bit lines.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2011
From: INNOVATIVE SILICON ISI SA
To: MICRON TECHNOLOGY, INC.
Reel/Frame 025882/0403 →