IC card and booking-account system using the IC card
View Patent ↗It is an object of the present invention to provide a highly sophisticated functional IC card that can ensure security by preventing forgery such as changing a picture of a face, and display other images as well as the picture of a face. An IC card comprising a display device and a plurality of thin film integrated circuits; wherein driving of the display device is controlled by the plurality of thin film integrated circuits; a semiconductor element used for the plurality of thin film integrated circuits and the display device is formed by using a polycrystalline semiconductor film; the plurality of thin film integrated circuits are laminated; the display device and the plurality of thin film integrated circuits are equipped for the same printed wiring board; and the IC card has a thickness of from 0.05 mm to 1 mm.
1. A method for manufacturing an article comprising:
forming a metal film over a substrate;
forming a metal oxide film by oxidizing a surface of the metal film;
selectively removing the metal film formed in an edge portion of the substrate;
forming a base film over the metal oxide film;
forming a semiconductor element over the base film; and
separating the semiconductor element and the base film from the substrate by physical means.
2. The method for manufacturing the article according to claim 1 , further comprising forming an insulating film on the substrate.
3. The method for manufacturing the article according to claim 1 , wherein the metal film includes tungsten.
4. The method for manufacturing the article according to claim 1 , wherein the semiconductor element comprises a thin film transistor.
5. The method for manufacturing the article according to claim 1 , wherein the semiconductor element comprises a memory element.
6. The method for manufacturing the article according to claim 1 , wherein the article is a card having a thickness of from 0.05 mm to 1 mm.
7. The method for manufacturing the article according to claim 1 , wherein the article further comprises an antenna.
8. A method for manufacturing an article comprising:
forming a metal film over a substrate;
forming a metal oxide film by oxidizing a surface of the metal film;
selectively removing the metal film formed in an edge portion of the substrate;
forming a base film over the metal oxide film;
forming a semiconductor element over the base film;
forming a pixel electrode electrically connected to the semiconductor element; and
separating the pixel electrode, the semiconductor element and the base film from the substrate by physical means.
9. The method for manufacturing the article according to claim 8 , further comprising forming an insulating film on the substrate.
10. The method for manufacturing the article according to claim 8 , wherein the metal film includes tungsten.
11. The method for manufacturing the article according to claim 8 , wherein the semiconductor element comprises a thin film transistor.
12. The method for manufacturing the article according to claim 8 , wherein the article is a card having a thickness of from 0.05 mm to 1 mm.
13. The method for manufacturing the article according to claim 8 , wherein the article further comprises an antenna.
14. The method for manufacturing the article according to claim 8 , wherein the article is a display device.
15. The method for manufacturing the article according to claim 14 , wherein the display device is a liquid crystal display device.
16. A method for manufacturing an article comprising:
forming a metal film over a substrate;
forming an oxide film over the metal film wherein a metal oxide film is formed between the metal film and the oxide film;
selectively removing the metal film formed in an edge portion of the substrate;
forming a base film over the metal oxide film;
forming a semiconductor element over the base film;
forming a pixel electrode electrically connected to the semiconductor element; and
separating the pixel electrode, the semiconductor element and the base film from the substrate by physical means.
17. The method for manufacturing the article according to claim 16 , further comprising forming an insulating film on the substrate.
18. The method for manufacturing the article according to claim 16 , wherein the metal film includes tungsten.
19. The method for manufacturing the article according to claim 16 , wherein the semiconductor element comprises a thin film transistor.
20. The method for manufacturing the article according to claim 16 , wherein the article is a card having a thickness of from 0.05 mm to 1 mm.
21. The method for manufacturing the article according to claim 16 , wherein the article further comprises an antenna.
22. The method for manufacturing the article according to claim 16 , wherein the article is a display device.
23. The method for manufacturing the article according to claim 22 , wherein the display device is a liquid crystal display device.